EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Torx driver
T10
Description #2: Torx driver
T15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press the latch to remove top cover from chassis.
2. Locate the battery on the system board. Push the lock area of battery holder and remove the battery by hand.
3. Press the latch and rotate the handle to remove the BROC card from MB.
4. Remove megacell from left baffle and right baffle.
5. Remove the left baffle and mid baffle and right baffle from system.
6. Rotate the retention structure and remove the MEZZ card connectors from MB(if MEZZ cards installed).
7. Loose screws of MEZZ Card and remove the MEZZ frame.
8. Remove BLOM card from MB(if BLOM card installed).
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1
Attachment 1
–System Board Battery
Attachment 2
– Mega cell
