d.
WLAN module (see
WLAN module on page 82
)
e.
WWAN module (see
WWAN module on page 80
)
f.
Fan (see
Fan on page 87
)
g.
Keyboard (see
Keyboard on page 88
)
h.
Base enclosure (see
Base enclosure on page 93
)
i.
System board (see
System board on page 106
)
Remove the heat sink:
NOTE:
Steps 1 and 2 apply to computer models equipped with a graphics subsystem with discrete
memory. See steps 3 and 4 for heat sink removal information for computer models equipped with a
graphics subsystem with UMA memory.
1.
Following the 1, 2, 3, 4, 5, 6 sequence stamped into the heat sink, loosen the six captive Philllips
screws
(1)
and
(2)
that secure the heat sink to the system board.
2.
Remove the heat sink
(3)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
and the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
Steps 3 and 4 apply to computer models equipped with a graphics subsystem with UMA
memory. See steps 1 and 2 for heat sink removal information for computer models equipped with
a graphics subsystem with discrete memory.
112
Chapter 4 Removal and replacement procedures
