Reducing Risk of
Static Discharge
Damage
The smallest static voltage most people can feel is about 3500 V. It takes
less than one-tenth of that (about 300 V) to destroy or severely damage
static-sensitive circuits. Often, static damage does not immediately cause a
malfunction, but significantly reduces the component’s life. Adhering to the
following precautions will reduce the risk of static discharge damage.
•
Keep the module in its conductive plastic bag when not installed in a
VXIbus mainframe. Save the bag for future module storage.
•
Before handling the module, select a work area where potential static
sources are minimized. Avoid working in carpeted areas and
non-conductive chairs. Keep body movement to a minimum. If
possible, use a static-controlled workstation.
•
Avoid touching any components or edge connectors. When you are
ready to configure the module, remove it from its protective bag and
lay it on top of the bag while keeping your free hand in contact with
the bag. This technique maintains your body and the module at the
same static potential.
•
When you install the module, keep one hand in contact with the
protective bag as you pick up the module with your other hand.
Then, before installing the module, move your free hand to a metal
surface on the mainframe, thus bringing you, the module, and the
mainframe to the same static potential.
Hardware Description
Figure 2-1 shows the module with interface circuit components installed. As
shown, the module consists of a circuit board with one backplane connector
(P1) and a front panel connector (J1). Approximately one-third of the circuit
board contains traces for installing the backplane interface circuitry. See
"Backplane Interface Circuitry" for interface circuitry installation.
Backplane
Connections
The breadboard module interfaces your custom circuits to a standard B-size
VXIbus backplane (connector P1). This enables you to access the backplane
control signals, data lines, address lines, and power supplies. Figure 2-1
shows backplane connector (P1) which connects to the VXIbus backplane.
Module Dimensions
Figure 2-2 shows the dimensions of the module and the component height
and lead length restrictions. The maximum component height allowed
above the circuit board is 12.7mm (0.5in). The maximum component lead
length allowed below the circuit board is 1.3mm (0.05in). Do not mount
components closer than 4mm (0.16in) to the extreme upper or lower edges
of the circuit board. This space is used to guide the module into the
mainframe module slot. An area of 220 cm
2
(34 in
2
) is available on the
module to install your own circuitry.
16 Configuring the HP E1399A
Chapter 2
Summary of Contents for E1399A
Page 6: ...Notes 6 HP E1399A Register Based Breadboard Module User s Manual ...
Page 8: ...8 HP E1399A Register Based Breadboard Module User s Manual ...
Page 11: ...Figure 1 1 Digital Backplane Interface Block Diagram Chapter 1 HP E1399A Introduction 11 ...
Page 14: ...14 HP E1399A Introduction Chapter 1 ...
Page 18: ...Figure 2 2 HP E1399A Dimensions 18 Configuring the HP E1399A Chapter 2 ...
Page 21: ...Figure 2 5 Terminal Module Installation Chapter 2 Configuring the HP E1399A 21 ...
Page 40: ...Figure 3 2 Timing for Reading the Status Register 40 Using the HP E1399A Chapter 3 ...
Page 43: ...Figure 3 4 Timing for Writing to the Control Register Chapter 3 Using the HP E1399A 43 ...
Page 45: ...Figure 3 5 Interrupt Timing Chapter 3 Using the HP E1399A 45 ...
Page 53: ...Appendix B HP E1399A Parts List Schematic 53 ...
Page 54: ...Figure B 1 HP E1399A Breadboard Schematic 1 of 2 54 HP E1399A Parts List Schematic Appendix B ...
Page 55: ...Figure B 1 HP E1399A Breadboard Schematic 2 of 2 Appendix B HP E1399A Parts List Schematic 55 ...
Page 56: ...56 HP E1399A Parts List Schematic Appendix B ...
