MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in
product
3 SAS expansion cables for each of 2 IOMs.
1 RJ45 cables for each of 2 IOMs.
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts, and materials containing
refractory ceramic fibers
0
Components, parts, and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips driver
#0, #1, #2
Torx driver
T10, T25
Hex driver
#2
Socket driver
10mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the bezel and hubcaps from the front of the enclosure.
2. Remove all disk drives.
3. For each disk drive, remove the disk from the plastic carrier.
4. Remove both power supply units (PSUs), both IOMs, and fan modules.
5. Disassemble each PSU. See the PSU disassembly procedure.
6. Disassemble each IOM. See the IOM disassembly procedure.
7. Disassemble each fan module. See the fan module disassembly procedure.
8. Disassemble the chassis. See the chassis disassembly procedure.
