HP Compaq LE1902x, Disassembly Instructions Manual

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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Hand
Description #2
Slotted
Screwdriver
Description #3
Philips
Screwdriver
Description #4
Hex Socket
Screwdriver
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. To remove the screw for removing base and wall mount holes. AND release top
、
right and left side snaps of bezel to
remove the bucket.
2. Remove the keypad, key and lens, bezel and panel.
3. Remove all the screws that fix the main board and power board and mylar.
4. Press the tongue to remove the clip and back cover.
5. To remove the screw for removing front cover and hinge.
6. To remove all rubbers and screw.
7. Destroy all boss pillars to remove the plate for removing base cover.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).