EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver, wire cutters
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel from the unit
2. Remove all the cables from PCA
3. Remove PCI & PCI-E card from the PCA
4. Remove HDD
5. Take off Front Panel
6. Take off ODD
7. Take off system FAN
8. Take off CMOS battery
9. Take off PSU from the Unit
10. cut off wire tie
11. open PSU
12. remove large electrolytic capacitors and PSU FAN
13.
14.
15.
16.
17.
18.
19.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1 Remove access panel from the unit
Release the screw and slide access panel and remove
it.
