HP 5004A, Operating And Service Manual

Page: 59 / 74

Model
Service
NOTE
If the heat sink on the rear panel is still holding the cover together,
loosen the sink screws a few more turns.
WARNING
BE O F EXPOSED VOLTAGE POINTS.
If necessary the bottom cover can be removed.
8. To reassemble the reverse the preceding steps.
8-46. Data Probe Disassembly and Reassembly
8-47. To disassemble the data probe, use the following procedure.
1. Disconnect the power cable from the Remove the GND wire from the probe.
Figure shows the mechanical parts of the probe. Figure
the probe with its covers removed.
2. Remove the probe tip by turning it with fingers counterclockwise.
NOTE
The red window has a projecting stud that fits in the body of the
probe near the GND pin (off-set slightly).
Carefully pull the red window off the probe tip.
Slide the two half covers carefully off the probe printed circuit board.
NOTE
The two body shells interlock to cover the printed circuit board.
5. Reverse the preceding steps to reassemble the data probe.
8-48. Gating Signals Pod Disassembly and Reassembly
8-49. To disassemble the gating signals pod, use the following procedure.
1. Disconnect the power cable from the
NOTE
Figure shows the mechanical parts of the pod. Figure 8-7 shows
the probe with its covers removed.
2. Squeeze the ends of the pod test leads connector and pull the connector off the pod.
3. Remove the four screws from the bottom cover of the pod, and carefully remove the
top cover. The bottom cover can also be removed if necessary.
NOTE
The pod cable has a strain protector which fits in a slot in the covers
of the pod.
4. Reverse the above procedure to reassemble the pod.