The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink, processor, and system board spare part kits.
The following illustrations show replacement thermal material locations.
●
Discrete graphics:
Thermal paste is used on the processor and associated heat sink area
(1)(2)
, as well
as the graphics chip and associated heat sink area
(3)(4)
.
●
UMA graphics:
Thermal paste is used on the processor
(1)
and the heat sink
(2)
.
Reverse this procedure to reassemble and install the heat sink assembly.
Component replacement procedures
93
Summary of Contents for 240 G3
Page 4: ...iv Safety warning notice ...
Page 14: ...6 Chapter 1 Product description ...
Page 26: ...18 Chapter 2 External component identification ...
Page 104: ...96 Chapter 4 Removal and replacement procedures ...
Page 108: ...100 Chapter 5 Using Setup Utility BIOS and HP PC Hardware Diagnostics UEFI in Windows 8 ...
Page 112: ...104 Chapter 6 Using Setup Utility BIOS and System Diagnostics in Windows 7 ...
Page 138: ...130 Chapter 12 Statement of Volatility ...
Page 142: ...134 Chapter 13 Power cord set requirements ...
Page 144: ...136 Chapter 14 Recycling ...
Page 148: ...140 Index ...