Page 4
RF65
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8.1.
Package Outline Drawing..............................................................................................................................
69
8.2.
Thermal Impedance ......................................................................................................................................
69
9.
Chip Revisions ........................................................................................................................................................ 70
9.1.
RC Oscillator Calibration...............................................................................................................................
70
9.2.
Listen Mode...................................................................................................................................................
70
9.2.1. Resolutions...............................................................................................................................................
70
9.2.2. Exiting Listen Mode ..................................................................................................................................
71
9.3.
OOK Floor Threshold Default Setting ...........................................................................................................
71
9.4.
AFC Control ..................................................................................................................................................
71
9.4.1. AfcAutoClearOn .......................................................................................................................................
71
9.4.2. AfcLowBetaOn and LowBetaAfcOffset.....................................................................................................
71
9.5.
ContinuousDagc............................................................................................................................................
71
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
6.4.
IRQ and Pin Mapping Registers ....................................................................................................................
60
6.5.
Packet Engine Registers ...............................................................................................................................
62
6.6.
Temperature Sensor Registers .....................................................................................................................
65
6.7.
Test Registers ...............................................................................................................................................
65
7.
Application Information ......................................................................................................................................... 66
7.1.
Crystal Resonator Specification ....................................................................................................................
66
7.2.
Reset of the Chip ..........................................................................................................................................
66
7.2.1. POR............................................................................................................................................................ 66
7.2.2. Manual Reset ...........................................................................................................................................67
7.3.
Reference Design ......................................................................................................................................... 67
8.
Packaging Information ...........................................................................................................................................69