●
QFP Desoldering
1. Set the temperature and adjust the air
flow control knob.
Set the temperature (refer to page 6) and
adjust the air flow control knob to desired
temperature and the level.
WARNING
If the thermal protector is tripped (the heater lamp
turns off during use), reduce the temperature setting
or increase the air flow. Be sure not to operate the
unit with temperature and air flow settings that
makes the thermal protector trip. This could damage
the unit.
2. Place the FP pick-up under the IC lead.
Slip the FP pick-up wire under the IC lead.
(Refer to the photo shown.)
If the width of the IC does not match the size
of the FP pick-up, adjust the width of the
pick-up by squeezing the wire. In case of
PLCC or small components such as chip
resistors, desolder by using tweezers, etc.
3. Heating
Hold the handpiece so that the nozzle is
located directly over, but not touching the IC,
and allow the hot air to melt the solder. Be
careful not to touch the leads of the IC with
the nozzle.
4. Remove the IC.
Once the solder has melted, remove the IC
by lifting the FP pick-up.
5. Remove any remaining solder.
After removing the IC, remove remaining
solder with a soldering iron and wick or
desoldering tool.
USE
4
5
AIR CONTROL
3
2
1
8
6
7
TEMPERATURE RANGE 100-450
°
C
212-842
°
F
POWER
TEMP CONTROL
DOWN
UP
®
Airflow control knob
8
