3
Table 2 Temperature/humidity requirements in the equipment room
Model
Operating temperature
Operating humidity
•
H3C
MSR810
{
RT-MSR810-W
{
RT-MSR810-W-DB
{
RT-MSR810-LM
{
RT-MSR810-W-LM
•
H3C
MSR810
Series
{
RT-MSR810
{
RT-MSR810-LM-
CNDE-SJK
{
RT-MSR810-10-PoE
{
RT-MSR810-LM-HK
{
RT-MSR810-W-LM-
HK
{
RT-MSR810-LM-GL
{
RT-MSR810-W-LM-GL
0°C to 40°C (32°F to 104°F)
5% RH to 90% RH, noncondensing
•
RT-MSR810-LME
•
RT-MSR810-LMS
•
RT-MSR810-LMS-EA
•
RT-MSR810-LUS
0°C to 40°C (32°F to 104°F)
0% RH to 95% RH, noncondensing
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 3 Dust concentration limit in the equipment room
Substance
Concentration limit (particles/m
3
)
Dust particles
≤
3 x 10
4
(No visible dust on the tabletop in three days)
NOTE:
Dust diameter
≥
5 µm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion
and premature aging of components, as shown in
.
Table 4 Harmful gas limits in an equipment room
Gas
Maximum concentration (mg/m
3
)
SO
2
0.2
H
2
S 0.006
NH
3
0.05
NO
2
0.04
Cl
2
0.01
