Minimal Design for GR551x SoC
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Connect ferrite beads in series to the GND pins on the metal shell, and connect the GND pins to the GND circuit
on the motherboard, to protect the motherboard from static electricity transmitted through the metal shell.
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Suspended metal structure is not allowed. The steel stiffener of sensors (such as touch/display sensors) shall be
grounded.
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Try to avoid close contact between the overlapped area between the FPC on the motherboard and the FPC
on touch/display sensor module. It is recommended to apply heat resistant adhesives on the exposed area of
motherboard connectors, to prevent short circuit or static electricity from setting in.
3.2.7.2 ESD Considerations in Production, Transport, and Debugging
To steer away from ESD events, stringent ESD control is also required during production, transport, debugging, and
other relevant phases.
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Wear antistatic wrist strap in these processes. Touching the SoC with bare hands or using metal tweezers is
forbidden.
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Use an antistatic bag/tray to hold the SoC.
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Countermeasures against ESD are essential for soldering irons, welding tables, and test instruments.
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Strictly comply with ESD preventive requirements for the production line during production and transport.
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