Gemalto Cinterion ELS31-VA Description Download Page 77

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Cinterion

ELS31-VA/ELS51-VA Hardware Interface Description

4 Mechanical Dimensions, Mounting and Packaging



ELS31-VA_ELS51-VA_HID_v01.000

2017-01-04

Confidential / Preliminary

Page 77 of 106

Mechanical Dimensions, Mounting and Packaging

The following sections describe the mechanical dimensions of ELS31-VA/ELS51-VA and give
recommendations for integrating ELS31-VA/ELS51-VA into the host application.

4.1

Mechanical Dimensions of ELS31-VA/ELS51-VA

Figure 40

shows the top and bottom view of ELS31-VA/ELS51-VA and provides an overview

of the board's mechanical dimensions. For further details see

Figure 41

Figure 40:

ELS31-VA/ELS51-VA– top and bottom view

Product label

Top view

Bottom view

Summary of Contents for Cinterion ELS31-VA

Page 1: ... M2M GEMALTO COM Cinterion ELS31 VA ELS51 VA Hardware Interface Description Version 01 000 DocId ELS31 VA_ELS51 VA_HID_v01 000 ...

Page 2: ...LIV ERY OF THE PRODUCT THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW Copyright Transmittal reproduction dissemination and or editing of this document as well as utilization of its con tents and communication thereof to others without express authorization are prohibited Offenders will be held liable for payment of damages All rights created by patent grant or registrati...

Page 3: ...al Interface ASC1 27 2 1 6 UICC SIM USIM Interface 29 2 1 7 Digital Audio Interface 31 2 1 8 Pulse Code Modulation Interface PCM 31 2 1 9 Inter IC Sound Interface I2 S 33 2 1 10 GPIO Interface 34 2 1 11 I2 C Interface 36 2 1 12 SPI Interface 38 2 1 13 Pulse Counter 39 2 1 14 HSIC Interface ELS51 VA Only 39 2 1 15 SDIO Interface ELS51 VA Only 39 2 1 16 Control Signals 42 2 1 16 1 Status LED 42 2 1 ...

Page 4: ...Power Saving while Attached to LTE Networks 66 3 3 2 Wake up via RTS0 RTS1 67 3 4 Power Supply 68 3 4 1 Power Supply Ratings 69 3 4 2 Minimizing Power Losses 70 3 4 3 Measuring the Supply Voltage BATT_BB 70 3 4 4 Monitoring Power Supply by AT Command 70 3 5 Operating Temperatures 71 3 6 Electrostatic Discharge 72 3 6 1 ESD Protection for Antenna Interface 72 3 7 Blocking against RF on Interface Li...

Page 5: ... Barrier Bag 88 4 3 2 2 Transportation Box 90 4 3 3 Trays 91 5 Regulatory and Type Approval Information 93 5 1 Directives and Standards 93 5 2 SAR requirements specific to portable mobiles 95 5 3 Reference Equipment for Type Approval 96 5 4 Compliance with FCC and IC Rules and Regulations 97 6 Document Information 99 6 1 Revision History 99 6 2 Related Documents 100 6 3 Terms and Abbreviations 100...

Page 6: ...15 Signal states 62 Table 16 Temperature dependent behavior 64 Table 17 Voltage supply ratings 69 Table 18 Current consumption ratings 69 Table 19 Board temperature 71 Table 20 Electrostatic values 72 Table 21 EMI measures on the application interface 74 Table 22 Summary of reliability test conditions 76 Table 23 Reflow temperature ratings 82 Table 24 Storage conditions 84 Table 25 Directives 93 T...

Page 7: ...Figure 24 Embedded Stripline with 65µm prepreg 1080 and 710µm core 49 Figure 25 Micro Stripline on 1 0mm standard FR4 2 layer PCB example 1 50 Figure 26 Micro Stripline on 1 0mm Standard FR4 PCB example 2 51 Figure 27 Micro Stripline on 1 5mm Standard FR4 PCB example 1 52 Figure 28 Micro Stripline on 1 5mm Standard FR4 PCB example 2 53 Figure 29 Schematic diagram of ELS31 VA ELS51 VA sample applic...

Page 8: ...idential Preliminary Page 8 of 106 Figure 50 Moisture Sensitivity Label 89 Figure 51 Humidity Indicator Card HIC 90 Figure 52 Small quantity tray 91 Figure 53 Tray to ship odd module amounts 91 Figure 54 Trays with packaging materials 91 Figure 55 Tray dimensions 92 Figure 56 Reference equipment for Type Approval 96 ...

Page 9: ...ux execution environment available for customer applications 1 1 Key Features at a Glance 1 The document is effective only if listed in the appropriate Release Notes as part of the technical docu mentation delivered with your Gemalto M2M product Feature Implementation General Frequency bands LTE dualband B4 B13 Output power Class 3 23dBm 2dB for LTE AWS LTE B4 Class 3 23dBm 2dB for LTE 700 LTE FDD...

Page 10: ...g support Supports RTS0 CTS0 hardware flow control Indication of incoming data SMS on RING0 can be used to wake up host from power down modes ASC1 shared with GPIO lines 4 wire unbalanced asynchronous interface Default baud rate 115 200 baud Adjustable baud rates 4 800bps to 921 600bps Supports RTS1 CTS1 hardware flow control UICC interface Supported SIM USIM cards 3V 1 8V Embedded UICC Module is ...

Page 11: ...ical temperature and voltage conditions Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST Evaluation kit Evaluation module ELS31 VA ELS51 VA module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75 DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a ...

Page 12: ...e 1 ELS31 VA ELS51 VA system overview GPIO interface I2C USB ASC0 ASC0 CONTROL POWER ANTENNA LTE dual band Module SIM interface with SIM detection SIM card Application Power supply Emergency reset ON Serial modem interface Serial modem interface I2C USB Antenna div Antenna GPIOs Status LED FST_SHDN Fast shutdown ADC ADC COUNTER Pulse counter GP I Os HSIC SDIO HSIC SDIO SPI SPI SPI SPI ASC1 Serial ...

Page 13: ...nd power management serial NOR flash and LPDDR RAM memory Application interface SMT with connecting pads LTE RF section RF transceiver RF power amplifier front end module and duplexers Receive SAW filters Figure 2 ELS31 VA ELS51 VA baseband block diagram SPDT RFSwitch B13Duplexer B4Duplexer SPDT RFSwitch PADC DC PMIC B13 SAW B4 SAW SQN3241 B13 PA B4 PA Primary Antenna Diversity Antenna TCXO Contro...

Page 14: ...onnecting pads numbering plan the following Table 1 lists the pads assignments Figure 3 Numbering plan for connecting pads bottom view 53 65 64 63 62 61 60 59 58 57 56 55 54 66 33 21 22 23 24 25 26 27 28 29 30 31 32 20 106 92 91 98 97 96 95 94 90 89 85 86 93 74 99 87 88 84 83 79 78 77 76 75 82 81 80 72 71 70 69 68 67 105 104 103 102 101 100 73 44 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 34 ...

Page 15: ...1 CP_WAKEUP 53 BATT_BB 10 V180 32 GPIO19 CTS1 SUSPEND 54 GND 11 RXD0 33 EMERG_RST 55 GND 12 CTS0 34 GND 56 DIV_ANT 13 TXD0 35 GPIO25 57 GND 14 RING0 GPIO24 36 GPIO8 COUNTER 58 GND 15 RTS0 37 GPIO7 59 RF_OUT 16 Not connected 38 GPIO6 60 GND 17 CCRST 39 LED GPO5 61 GND 18 CCIN 40 GPIO4 FST_SHDN 62 GND 19 CCIO 41 DSR0 GPIO3 63 GND 20 CCVCC 42 DCD0 GPIO2 64 GND 21 CCCLK 43 DTR0 GPIO1 65 GPIO27 SPI_CS2...

Page 16: ...evel shifters at the interfaces or to supply external application cir cuits If unused keep line open VCORE O VOnorm 1 1V VOmin 1 09 VOmax 1 12 IOmax 50mA CLmax 100nF Ignition ON I BATT_BB 4 5V VIHmax 5 5V VIHmin 2 16V VILmax 1 79V VILmin 0V BATT_BB 3 3V VIHmax 5 5V VIHmin 1 7V VILmax 1 3V VILmin 0V Min low time before rising edge 100µs Rin 380k ON ___ ____ high level min 100µs Edge triggered signa...

Page 17: ...characteris tics according USB 2 0 Specification USB_DP Serial Interface ASC0 RXD0 O VOLmax 0 45V VOHmin 1 35V VOHmax 1 85V VILmax 0 63V VILmin 0 3V VIHmin 1 17V VIHmax 1 85V If unused keep lines open By delivery default lines are available as ASC0 interface lines If configured for use as GPIOs the assignment is as follows DTR0 GPIO1 DCD0 GPIO2 DSR0 GPIO3 RING0 GPIO24 CTS0 O RING0 O TXD0 I RTS0 I ...

Page 18: ... 0 45V VOHmin 1 35V VOHmax 1 85V VILmax 0 63V VILmin 0 3V VIHmin 1 17V VIHmax 1 85V If lines are unused keep lines open By delivery default the SPI CS interface lines are available as GPIO lines If configured as SPI lines the GPIO lines are assigned as follows GPO26 SPI_CS1 GPIO27 SPI_CS2 SPI_MOSI O SPI_MISO I SPI_CS1 SPI_CS2 O GPIO inter face GPIO1 4 GPIO6 22 GPIO24 25 27 IO VOLmax 0 45V VOHmin 1...

Page 19: ...PIO8 COUNTER ADC Analog to Digital con verter ADC1 I RI 10kOhm VI 0V 2 0V Resolution 1024 steps Tolerance 2 ADC1 can be used as input for external mea surements If unused keep line open SIM card detection CCIN I RI 90kOhm VILmax 0 63V VIHmin 1 17V VIHmax 1 85V CCIN High SIM card inserted For details please refer to Section 2 1 6 If unused keep line open 3V SIM Card Inter face CCRST O VOHtypical 2 ...

Page 20: ...B Electrical Specification Version 1 September 23 2007 HSIC available with ELS51 VA only See also Section 2 1 14 SDIO SDIOCMD SDIOCLK SDIO0 SDIO1 SDIO2 SDIO3 IO VOLmax 0 45V VOHmin 1 35V VOHmax 1 85V VILmax 0 63V VIHmin 1 17V VIHmax 1 85V SDIO available with ELS51 VA only See also Section 2 1 15 Digital audio interface PCM I2 S PCM_I2S_ CLK I VILmax 0 63V VIHmin 1 17V VIHmax 1 85V If unused keep l...

Page 21: ...se permanent damage to ELS31 VA ELS51 VA Table 3 Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT BB BATT RF 0 3 4 5 V Voltage at all digital lines in Power Down mode 0 3 0 3 V Voltage at digital lines in normal operation 0 2 2 0 V Voltage at SIM USIM interface CCVCC in normal operation 0 5 3 6 V Voltage at ADC line in normal operation 0 2 V Voltage at analog lines in Power Down...

Page 22: ...B circuit To properly connect the module s USB interface to the external application a USB 2 0 compat ible connector and cable or hardware design is required For more information on the USB re lated signals see Table 2 Furthermore the USB modem driver distributed with ELS31 VA ELS51 VA needs to be installed 1 The specification is ready for download on http www usb org developers docs VBUS DP DN VR...

Page 23: ...e a hot swappable item The filter is used to offer high impedance to higher frequency components of the USB signals This helps reduce any potential RF noise coming from these USB wires Figure 5 USB Additional ESD Protection Implementation The digital signals USB_DP and USB_DN are sensitive to track design Make sure these sig nals are routed with 90 Ohms differential resistance If the host product ...

Page 24: ...e the bus in the Suspended state it commands the Host Con troller to stop all bus traffic including SOFs This causes all USB devices to enter the Sus pended state In this state the USB System may enable the Host Controller to respond to bus wakeup events This allows the Host Controller to respond to bus wakeup signaling to restart the host system Implementation for legacy USB applications not supp...

Page 25: ...e following signals Port TXD application sends data to the module s TXD0 signal line Port RXD application receives data from the module s RXD0 signal line Figure 6 Serial interface ASC0 Features Includes the data lines TXD0 and RXD0 the status lines RTS0 and CTS0 and in addition the modem control lines DTR0 DSR0 DCD0 and RING0 Configured for 8 data bits no parity and 1 stop bit ASC0 can be operate...

Page 26: ...the startup behavior of the asynchronous serial interface ASC0 For pull up and pull down values see Table 15 Figure 7 ASC0 startup behavior No data must be sent over the ASC0 interface before the interface is active and ready to re ceive data see Section 3 2 1 TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 ON EMERG_RST Power supply active Start up Firmware initialization Command interface initialization...

Page 27: ...e 1 AT SCFG The configuration is non volatile and becomes active after a module restart ELS51 VA is designed for use as a DCE Based on the conventions for DCE DTE connections it communicates with the customer application DTE using the following signals Port TXD application sends data to module s TXD1 signal line Port RXD application receives data from the module s RXD1 signal line Figure 8 Serial ...

Page 28: ...LS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 28 of 106 For pull down values see Table 15 Figure 9 ASC1 startup behavior TXD1 RXD1 RTS1 CTS1 ON Power supply active Start up Firmware initialization Command interface initialization Interface active V180 VCORE EMERG_RST Reset state 15sec ...

Page 29: ...or example this is true for the model supplied by Molex which has been test ed to operate with ELS31 VA ELS51 VA and is part of the Gemalto M2M reference equipment submitted for type approval See Section 7 1 for Molex ordering numbers Note No guarantee can be given nor any liability accepted if loss of data is encountered after removing the SIM card during operation Also no guarantee can be given ...

Page 30: ...e pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51 010 1 and to satisfy the requirements of EMC compliance To avoid possible cross talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other A useful approach is using a GND line to shield the CCIO line from the CCCLK line The ELS31 VA...

Page 31: ...lly down to 8kHz in a narrowband call Therefore the PCM sample rate is independent of the audio bandwidth of the call The PCM interface has the following implementation Slave mode Short frame synchronization long frame synchronization 8kHz and 16kHz sample rate 256kHz 512kHz 2048kHz bit clock at 8kHz sample rate 256kHz 512kHz 1024kHz 4096kHz bit clock at 16kHz sample rate For the PCM configuration...

Page 32: ... Audio Modes ELS31 VA ELS51 VA has various audio modes selectable with AT SNFS for details on AT SNFS see 1 Audio mode 1 with its default settings is used for type approval with the Votronic handset via the DSB75 codec adapter The handset is adjusted for the type 3 2 low leakage ear simulator for narrowband and wideband calls The other modes are customer specific modes and can as such be prepared ...

Page 33: ...ut Sampling rate 8KHz narrowband 16KHz wideband 256kHz bit clock at 8kHz sample rate 512kHz bit clock at 16kHz sample rate Frame length 32 bit stereo voice signal 16 bit word length The digital audio interface lines available for the PCM interface are also available for the I2 S interface In I2 S mode they have the same electrical characteristics Table 6 lists the available I2 S interface signals ...

Page 34: ... configuration variants for the GPIO pads All variants are mutu ally exclusive i e a pad configured for instance as Status LED is locked for alternative usage After startup the above mentioned alternative GPIO line assignments can be configured using AT commands see 1 The configuration is non volatile and available after module restart Notes GPO5 GPO23 and GPO26 are GPOs only Table 7 GPIO lines an...

Page 35: ...the startup behavior of the GPIO interface With an active state of the ASC0 interface line CTS0 the initialization of the GPIO interface lines is also finished For pull down values see Table 15 Figure 13 GPIO startup behavior GPIO1 8 Hi Z CTS0 ON EMERG_RST Power supply active Start up Firmware initialization Command interface initialization Interface active V180 VCORE GPIO16 27 Hi Z Reset state ...

Page 36: ... receives data only on request of the module To configure and activate the I2C bus use the AT SSPI command Detailed information on the AT SSPI command as well explanations on the protocol and syntax required for data transmis sion can be found in 1 The I2 C interface can be powered via the V180 line of ELS31 VA ELS51 VA If connected to the V180 line the I2 C interface will properly shut down when ...

Page 37: ...tup behavior of the I2 C interface With an active state of the ASC0 interface i e CTS0 is at low level the initialization of the I2 C interface is also finished Figure 15 I2 C startup behavior I2CCLK I2CDAT Open drain Open drain external pull up external pull up CTS0 ON EMERG_RST Power supply active Start up Firmware initialization Command interface initialization Interface active V180 VCORE Reset...

Page 38: ...S2 The configuration is done by AT command see 1 It is non volatile and becomes active after a module restart To configure and activate the SPI interface use the AT SSPI command Detailed information on the AT SSPI command as well explanations on the SPI modes required for data transmis sion can be found in 1 In general SPI supports four operation modes The modes are different in clock phase and cl...

Page 39: ...B and data HSIC_DATA used in a source synchronous serial interface with a 240MHz clock to provide a 480Mbps USB interface The HSIC_STRB and HSIC_DATA lines are high speed signals and should be rout ed as 50Ohm impedance traces The trace length of these signals should be balanced to min imize timing skew and be no longer than 100mm The HSIC interface implementation complies with the USB HSIC standa...

Page 40: ...interface timing diagrams Input Output Table 9 SDIO interface lines Signal Direction Description SDIOCLK Out SD master clock output to SD MMC SDIO device SDIOCMD I O Command line SDIO0 I O Data lines Only SDIO0 carries data in 1 bit SD mode SDIO0 3 carry data in 4 bits mode SDIO interrupt is multiplexed with SDIO1 SDIO1 I O SDIO2 I O SDIO3 I O Table 10 SDIO timings Mode Parameter Minimum Maximum N...

Page 41: ...up time 6ns TIH Input hold time 2ns TODLY Output delay time during Date Transfer Mode 0ns 14ns TOH Output hold time 2 5ns USH 1 TISU Input set up time 3ns TIH Input hold time 0 8ns TODLY Output delay time during Date Transfer Mode SDR12 SDR25 0ns 14ns TODLY Output delay time during Date Transfer Mode SDR50 0ns 7 5ns TOH Output hold time 1 5ns Table 10 SDIO timings Mode Parameter Minimum Maximum ...

Page 42: ...1 Status LED The LED line can also be configured as GPO5 line and can be used to drive a status LED that indicates different operating modes of the module for GPOs see Section 2 1 10 LED and GPO functionality are mutually exclusive To take advantage of this function connect an LED to the LED GPO5 line as shown in Figure 18 Figure 18 Status signaling with LED driver VCC GPO5 LED LED GND GND R1 R2 R...

Page 43: ...9 denotes the module s active state with a low signal and the module s Power Down mode with a high signal or high impedance state Figure 19 Power indication circuit 2 1 16 3 Host Wakeup If no call data or message transfer is in progress the host may shut down its own USB inter face to save power If a call or other request URC s messages arrives the host can be noti fied of these events and be woke...

Page 44: ...driven high and the host will fall asleep if RING0 remains high note Host shall wait at least for one UART character after RTS0 is driven high before entering sleep mode to catch the last potential character transmission over UART The module will wake up the host driving RING0 from high to low The Host will inform the module it is ready to receive over UART by driving RTS0 to low Figure 20 Wake up...

Page 45: ...tarts the fast shutdown procedure The fast shutdown procedure still finishes any data activities on the module s flash file system thus ensuring data integrity but the module will no longer deregister gracefully from the network On going flash access cycles writing deleting will be finalized within less than 200 milliseconds If the module is in power sleep mode the 200 milliseconds maximum shut do...

Page 46: ... impedance of 50Ω Regarding the return loss ELS31 VA ELS51 VA provides the following values in the active band 2 2 1 Antenna Interface Specifications ELS31 VA ELS51 VA is equipped with two receiver ports The sensitivity results according to Table 13 are verified by using both antenna ports according to the recommendation given in 3GPP TS 36 521 1 Chapter 7 2 The sensitivity results also depend on ...

Page 47: ...nna should result in a 50Ω line impedance Line width and distance to the GND plane needs to be optimized with regard to the PCB s layer stack Some examples are given in Section 2 2 3 To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB it is recommended to realize the antenna connection line using embedded Stripline rat...

Page 48: ...our external application The RF inter connects called RF Port 1 and RF Port 2 are examples only Depending on the RF antenna the interfacing system will dictate the RF inter connects Figure 23 RF interface signals example Please be also aware of ESD protection required on the RF interface lines ESD protection might be utilized through the above pi network primarily intended for managing any additio...

Page 49: ... calculate line arrangements for specific applications and PCB materials for example from http www polarinstruments com commercial software or from http web awrcorp com Usa Products Optional Products TX Line free software Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65µm FR4 prepreg type 1080 and 710µm FR4 core 4 layer PCB Figure 24 Embedded Str...

Page 50: ... of 106 Micro Stripline This section gives two line arrangement examples for micro stripline Micro Stripline on 1 0mm Standard FR4 2 Layer PCB The following two figures show examples with different values for D1 ground strip separa tion Figure 25 Micro Stripline on 1 0mm standard FR4 2 layer PCB example 1 Antenna line Ground line Ground line Application board ...

Page 51: ...rface Description 2 2 RF Antenna Interface 56 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 51 of 106 Figure 26 Micro Stripline on 1 0mm Standard FR4 PCB example 2 Antenna line Ground line Ground line Application board ...

Page 52: ...000 2017 01 04 Confidential Preliminary Page 52 of 106 Micro Stripline on 1 5mm Standard FR4 2 Layer PCB The following two figures show examples with different values for D1 ground strip separa tion Figure 27 Micro Stripline on 1 5mm Standard FR4 PCB example 1 Antenna line Ground line Ground line Application board ...

Page 53: ...rface Description 2 2 RF Antenna Interface 56 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 53 of 106 Figure 28 Micro Stripline on 1 5mm Standard FR4 PCB example 2 Antenna line Ground line Ground line Application board ...

Page 54: ...ails on how to implement test points see 4 The EMC measures are best practice recommendations In fact an adequate EMC strategy for an individual application is very much determined by the overall layout and especially the po sition of components For example mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic Depe...

Page 55: ...106 Figure 29 Schematic diagram of ELS31 VA ELS51 VA sample application ELS31 ELS51 Main Antenna Div Antenna BATT RF BATT BB GPIOs LED COUNTER I2CCLK I2CDAT GND SDIO HSIC ON FST_SHUTDOWN ASC0 ASC1 USB V180 CCIN CCVCC CCIO CCRST CCCLK Power Supply 33pF 33pF 150µF Low ESR 2k2 2k2 V180 Blocking WiFi µC 1nF 10pF 10pF 220nF SIM USB Interfaces available only on ELS51 ...

Page 56: ...ck by the application interface recog nizing such a fault state is possible by V180 2 3 2 Sample Level Conversion Circuit Depending on the micro controller used by an external application the module s digital input and output lines i e ASC0 ASC1 or GPIO lines may require level conversion The following Figure 30 shows a sample circuit with recommended level shifters for an external application s mi...

Page 57: ...active communication via ASC0 ASC1 For power saving issues see Section 3 3 In IDLE mode the software can be active or in SLEEP state LTE DATA LTE data transfer in progress Power consumption depends on network settings and data transfer rate Power Down Normal shutdown after sending the power down command Software is not active Inter faces are not accessible Operating voltage remains applied Airplan...

Page 58: ...the first AT command can be sent to the module see also 1 3 2 1 1 Connecting ELS31 VA ELS51 VA BATT Lines Figure 31 shows sample external application circuits that allow to connect and also to tempo rarily disconnect the module s BATT_BB and BATT_RF lines from the external application s power supply Figure 31 illustrates the application of power using an externally controlled microcontroller The t...

Page 59: ...d off e g by calling AT SMSO it will immediately restart For the auto start mode it is recommended to set a pull up resistor of maximum TBD kOhm between the ON circuit and the BATT_BB power supply Note If during a power cycle or voltage drop the BATT_BB voltage level does not drop below 0 5V it may happen that the module can no longer start up properly because its reset condition was not reached T...

Page 60: ... module use the command AT CFUN See 1 for details 3 2 2 2 Restart ELS31 VA ELS51 VA Using EMERG_RST The EMERG_RST signal is internally connected to the central GSM processor A low level for more than 10 milliseconds sets the processor and with it all the other signal pads to their re spective reset state The reset state is described in Section 3 2 3 as well as in the figures show ing the startup b...

Page 61: ...o trigger EMERG_RST after a module turn off by a sudden incomplete power drop and before using ON to restart the module see also Section 3 2 1 2 Caution Generally use the EMERG_RST line only when due to serious problems the soft ware is not responding for more than 5 seconds Pulling the EMERG_RST line causes the loss of all information stored in the volatile memory Therefore this procedure is inte...

Page 62: ...0 interface line CTS0 has turned low see Section 2 1 4 Now the module is ready to receive and transmit data Abbreviations used in above Table 15 Table 15 Signal states Signal name Default functionality Reset state First start up configuration CCIO I O L CCRST I O L CCCLK O L O L CCIN I I PD RXD0 I PU O H TXD0 I I CTS0 I O H RTS0 I I PD GPIO1 DTR0 DTR0 T PD I PU GPIO2 DCD0 DCD0 T PD O GPIO3 DSR0 DS...

Page 63: ...VA ELS51 VA Using AT Command The best and safest approach to powering down ELS31 VA ELS51 VA is to issue the appropriate AT command This procedure lets ELS31 VA ELS51 VA log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply The mode is referred to as Power Down mode In this mode Before issueing the switch off AT com mand t...

Page 64: ...h as protecting the module from exposure to extreme conditions The presentation of the URCs depends on the settings selected with the AT SCTM write command for details see 1 AT SCTM 1 Presentation of URCs is always enabled AT SCTM 0 default Presentation of URCs is enabled during the 2 minute guard period after start up of ELS31 VA ELS51 VA After expiry of the 2 minute guard period the presen tatio...

Page 65: ...oltage threshold is calculated for max 400mV voltage drops during transmit burst Power supply sources for external applications should be designed to tolerate 400mV voltage drops without crossing the lower limit of 3 3 V For external applications oper ating at the limit of the allowed tolerance the default undervoltage threshold may be adapted by subtracting an offset For details see 1 AT SCFG MES...

Page 66: ...r a description of the Suspend state Being triggered by LTE network protocol while attached to LTE networks 3 3 1 Power Saving while Attached to LTE Networks The power saving possibilities while attached to a LTE network depend on the paging timing cycle of the base station During normal LTE operation i e the module is connected to a LTE network the duration of a power saving period varies It may ...

Page 67: ...lt 5s with no activity on ASC0 and ASC1 and no data to transmit by module to host in Linux dev tty driver CTS0 CTS1 will be driven high After a 2nd timeout equal or greater than the duration needed to receive one character at UART baudrate ex 1 05ms for 10bit 9600baud and while RTS0 RTS1 remains high which means an external application does not request the module to wake up the module will enter s...

Page 68: ...ut the document BATT refers to both voltage domains and power supply lines BATT_BB and BATT_RF The power supply of ELS31 VA ELS51 VA has to be a single voltage source at BATT_BB and BATT_RF It must be able to provide the current for all operation modes of the module All the key functions for supplying power to the device are handled by the power management section of the analog controller This IC ...

Page 69: ...ax Unit BATT_BB BATT_RF Supply voltage Directly measured at Module Voltage must stay within the min max values including voltage drop ripple spikes 3 3 4 5 V Voltage ripple Normal condition power control level for Pout max f 250 kHz f 250 kHz 110 30 mVpp mVpp Table 18 Current consumption ratings Description Conditions Power mW Typical rating 3 8V mA IBATT Power Down Mode 15µA Aiplane Mode 9 2 2 4 ...

Page 70: ...nterface s BATT pads 5 BATT_BB or 53 BATT_RF as shown in Figure 37 Figure 37 Position of reference points BATT_BB BATT_RF and GND 3 4 4 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT SBV command which returns the value related to the reference points BATT_BB and GND The module continuously measures the voltage at intervals depending on the operating mod...

Page 71: ...y to a great extent depending on operating mode used frequency band radio output power and cur rent supply voltage For more information regarding the module s thermal behavior please refer to 3 Table 19 Board temperature Parameter Min Typ Max Unit Normal operation 30 25 85 C Extended operation1 1 Extended operation allows normal mode speech calls or data transmission for limited time until automat...

Page 72: ...ed according to following standards Electrostatic values can be gathered from the following table Note The values may vary with the individual application design For example it matters whether or not the application platform is grounded over external devices like a computer or other equipment such as the Gemalto reference application described in Chapter 5 3 3 6 1 ESD Protection for Antenna Interf...

Page 73: ...ed below There are five possible variants of EMI measures A C that may be implemented between module and external application depending on the signal line see Figure 39 and Table 21 Pay attention not to exceed the maximum input voltages and prevent voltage overshots if using in ductive EMC measures The maximum value of the serial resistor should be lower than 1k on the signal line The max imum val...

Page 74: ... higher than 10pF The value of the capacitor depends on the external application CCIO x x x CCCLK x x x RXD0 x x x TXD0 x x x CTS0 x x x RTS0 x x x GPIO1 DTR0 x x x GPIO2 DCD0 x x x GPIO3 DSR0 x x x GPIO4 FST_SHDN x x x GPO5 LED x x x GPIO6 x x x GPIO7 x x x GPIO8 COUNTER x x x GPIO16 RXD1 AP_WAKEUP x x x GPIO17 TXD1 HOST_ACTIVE x x x GPIO18 RTS1 CP_WAKEUP x x x GPIO19 CTS1 SUSPEND x x x GPIO20 PC...

Page 75: ...idential Preliminary Page 75 of 106 BATT_RF x Measures required if BATT RF is close to internal LTE antenna e g 39pF blocking capacitor to ground BATT_BB x SDIOCMD x x x SDIOCLK x x x SDIO0 x x x SDIO1 x x x SDIO2 x x x SDIO3 x x x HSIC_DATA x x x HSIC_STRB x x x Table 21 EMI measures on the application interface Signal name EMI measures Remark A B C ...

Page 76: ...uency range 20 500Hz the Standard s acceleration reference value was increased to 20g Shock half sinus Acceleration 500g Shock duration 1ms 1 shock per axis 6 positions x y and z DIN IEC 60068 2 27 Dry heat Temperature 70 2 C Test duration 16h Humidity in the test chamber 50 EN 60068 2 2 Bb ETS 300 019 2 7 Temperature change shock Low temperature 40 C 2 C High temperature 85 C 2 C Changeover time ...

Page 77: ...llowing sections describe the mechanical dimensions of ELS31 VA ELS51 VA and give recommendations for integrating ELS31 VA ELS51 VA into the host application 4 1 Mechanical Dimensions of ELS31 VA ELS51 VA Figure 40 shows the top and bottom view of ELS31 VA ELS51 VA and provides an overview of the board s mechanical dimensions For further details see Figure 41 Figure 40 ELS31 VA ELS51 VA top and bo...

Page 78: ... 2017 01 04 Confidential Preliminary Page 78 of 106 Figure 41 Dimensions of ELS31 VA ELS51 VA all dimensions in mm Figure 42 Dimensions of ELS31 VA ELS51 VA all dimensions in mm bottom view 0 1 18 8 0 1 27 6 0 31 0 04 PCB 2 05 0 1 TOTAL TOP VIEW 18 8 27 6 0 8 1 2 0 4 0 55 0 55 1 05 0 4 2 6 0 4 1 45 1 05 0 15 1 64 0 9 1 1 1 1 0 16 0550 7 8 ...

Page 79: ...e also 4 Note To avoid short circuits between signal tracks on an external application s PCB and vari ous markings at the bottom side of the module it is recommended not to route the signal tracks on the top layer of an external PCB directly under the module or at least to ensure that signal track routes are sufficiently covered with solder resist 4 2 1 SMT PCB Assembly 4 2 1 1 Land Pattern and St...

Page 80: ...latform 92 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 80 of 106 The stencil design illustrated in Figure 44 is recommended by Gemalto M2M as a result of ex tensive tests with Gemalto M2M Daisy Chain modules Figure 44 Recommended design for 120 micron thick stencil top view dual design ...

Page 81: ... design and reflow profile into account For land and stencil pattern design recommendations see also Section 4 2 1 1 Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity to decrease sol der voids and to increase board level reliability Daisy chain modules for SMT characterization are available on request For details refer to 4 Generally solder past...

Page 82: ... and are as such meant as a general guideline For more information on reflow profiles and their optimization please refer to 4 Profile Feature Pb Free Assembly Preheat Soak Temperature Minimum TSmin Temperature Maximum TSmax Time tSmin to tSmax tS 150 C 200 C 60 120 seconds Average ramp up rate TSmax to TP 3K second max Liquidous temperature TL Time at liquidous tL 217 C 60 90 seconds Peak package...

Page 83: ...mum module temperature of 240 C This specifies the temperature as measured at the module s top side A maximum duration of 15 seconds at this temperature Please note that while the solder paste manufacturers recommendations for best temperature and duration for solder reflow should generally be followed the limits listed above must not be exceeded ELS31 VA ELS51 VA is specified for one soldering cy...

Page 84: ...imum Table 24 Storage conditions Type Condition Unit Reference Air temperature Low High 25 40 C IPC JEDEC J STD 033A Humidity relative Low High 10 90 at 40 C IPC JEDEC J STD 033A Air pressure Low High 70 106 kPa IEC TR 60271 3 1 1K4 IEC TR 60271 3 1 1K4 Movement of surrounding air 1 0 m s IEC TR 60271 3 1 1K4 Water rain dripping icing and frosting Not allowed Radiation Solar Heat 1120 600 W m2 ETS...

Page 85: ...el attached to each MBB see Figure 50 for details It is not necessary to bake ELS31 VA ELS51 VA if the conditions specified in Section 4 2 4 1 and Section 4 2 4 2 were not exceeded It is necessary to bake ELS31 VA ELS51 VA if any condition specified in Section 4 2 4 1 and Section 4 2 4 2 was exceeded If baking is necessary the modules must be put into trays that can be baked to at least 125 C Devi...

Page 86: ...ustrated in Figure 46 The figure also shows the proper part orientation The tape width is 44 mm and the ELS31 VA ELS51 VA mod ules are placed on the tape with a 28 mm pitch The reels are 330 mm in diameter with a core diameter of 100 mm Each reel contains 500 modules 4 3 1 1 Orientation Figure 46 Carrier tape Figure 47 Reel direction 44 mm 330 mm Reel direction of the completely equipped tape Dire...

Page 87: ...ckaging 92 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 87 of 106 4 3 1 2 Barcode Label A barcode label provides detailed information on the tape and its contents It is attached to the reel Figure 48 Barcode label on tape reel Barcode label ...

Page 88: ...ure Barrier Bag The tape reels are stored inside an MBB moisture barrier bag together with a humidity indi cator card and desiccant pouches see Figure 49 The bag is ESD protected and delimits mois ture transmission It is vacuum sealed and should be handled carefully to avoid puncturing or tearing The bag protects the ELS31 VA ELS51 VA modules from moisture exposure It should not be opened until th...

Page 89: ...Cinterion ELS31 VA ELS51 VA Hardware Interface Description 4 3 Packaging 92 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 89 of 106 Figure 50 Moisture Sensitivity Label ...

Page 90: ...or reused once removed from the MBB The humidity indicator card is a moisture indicator and is included in the MBB to show the ap proximate relative humidity level within the bag Sample humidity cards are shown in Figure 51 If the components have been exposed to moisture above the recommended limits the units will have to be rebaked Figure 51 Humidity Indicator Card HIC A baking is required if the...

Page 91: ... are an alternative to the single feed tape carriers normally used However the trays are not designed for machine processing They contain modules to be hand soldered onto an external application for in formation on hand soldering see 4 Figure 52 Small quantity tray Trays are packed and shipped in the same way as tape carriers including a moisture barrier bag with desiccant and humidity indicator c...

Page 92: ...Cinterion ELS31 VA ELS51 VA Hardware Interface Description 4 3 Packaging 92 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 92 of 106 Figure 55 Tray dimensions ...

Page 93: ...erican type approval CFR Title 47 Code of Federal Regulations Part 22 and Part 24 Telecommunications PCS US Equipment Authorization FCC OET Bulletin 65 Edition 97 01 Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950 1 Product Safety Certification Safety requirements California Leadfree Man date Covered by European RoHS requirements RSS1...

Page 94: ... 06 SJ T 11364 2006 Marking for Control of Pollution Caused by Electronic Information Products 2006 06 According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products ACPEIP the EPUP i e Environmental Protection Use Period of this product is 20 years as per the symbol shown here unless otherwise marked The EPUP is valid only as long as the product is o...

Page 95: ...verify whether or not further standards recommendations or directives are in force outside these areas Products intended for sale on US markets ES 59005 ANSI C95 1 Considerations for evaluation of human exposure to Electromagnetic Fields EMFs from Mobile Telecommunication Equipment MTE in the frequency range 30MHz 6GHz Please note that SAR requirements are specific only for portable devices and no...

Page 96: ... attenuator is cho sen to connect the evaluation module directly to the GSM UMTS test equipment instead of employing the SMA antenna connectors on the ELS31 VA ELS51 VA DSB75 adapter as shown in Figure 56 The following products are recommended Hirose SMA Jack U FL Plug conversion adapter HRMJ U FLP 40 for details see see http www hirose connectors com or http www farnell com Aeroflex Weinschel Fix...

Page 97: ...the antenna and any person of min 20cm can be assured during normal op erating conditions For mobile and fixed operation configurations the antenna gain including cable loss must not exceed the limits in the following Table 28 for FCC and IC IMPORTANT Manufacturers of portable applications incorporating ELS31 VA ELS51 VA modules are re quired to have their final product certified and apply for the...

Page 98: ... to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device FR Cet appareil numérique de classe B est conforme aux normes canadiennes ICES 003 et RSS 210 Son fonctionnement est soumis aux deux conditions suivantes 1 cet appareil ne doit pas causer d interférence et 2...

Page 99: ...ent Information 103 ELS31 VA_ELS51 VA_HID_v01 000 2017 01 04 Confidential Preliminary Page 99 of 106 6 Document Information 6 1 Revision History New document Cinterion ELS31 VA ELS51 VA Hardware Interface Description v01 000 Chapter What is new Initial document setup ...

Page 100: ...1 Asynchronous Controller Abbreviations used for first and second serial interface of the module B Thermistor Constant BER Bit Error Rate BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene European Conformity CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital to Ana...

Page 101: ...eneral Purpose Input Output GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance HR Half Rate HSIC High Speed Inter Chip I O Input Output IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Li Ion Li Lithium ...

Page 102: ...ent RAM Random Access Memory RF Radio Frequency RLS Radio Link Stability RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment RTS Request to Send Rx Receive Direction SAR Specific Absorption Rate SAW Surface Acoustic Wave SDIO Secure Digital Input Output SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMD Surface Mount Device SMS Sho...

Page 103: ...ns may lead to the suspension or denial of cellular services to the offender legal action or both Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes Switch off the cellular terminal when you are near petrol stations fuel depots chemical plants or where blasting operations are in progress Operation of any elec trical equipment in potentially explosive atmosph...

Page 104: ...emalto M2M IMEI Packaging unit ordering number L30960 N4590 A300 Module label number L30960 N4590 A300 11 ELS31 VA Evaluation Mod ule Gemalto M2M Ordering number L30960 N4581 A300 ELS51 VA Evaluation Mod ule Gemalto M2M Ordering number L30960 N4591 A300 DSB75 Evaluation Kit Gemalto M2M Ordering number L36880 N8811 A100 DSB Mini Compact Evaluation Board Gemalto M2M Ordering number L30960 N0030 A100...

Page 105: ...any Phone 49 6227 3091 0 Fax 49 6227 3091 8100 Email mxgermany molex com American Headquarters Lisle Illinois 60532 U S A Phone 1 800 78MOLEX Fax 1 630 969 1352 Molex China Distributors Beijing Room 1311 Tower B COFCO Plaza No 8 Jian Guo Men Nei Street 100005 Beijing P R China Phone 86 10 6526 9628 Fax 86 10 6526 9730 Molex Singapore Pte Ltd 110 International Road Jurong Town Singapore 629174 Phon...

Page 106: ...privacy protection eHealthcare and eGovernment efficiency convenient ticketing and dependable machine to machine M2M applications Gemalto develops secure embedded software and secure products which we design and personalize Our platforms and services manage these secure products the confidential data they contain and the trusted end user services they enable Our innovations enable our clients to o...

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