D2119 (RX300 S3)
Technical Manual
13
3
Features
3.1
Overview
Processors
–
1 or 2 x Intel
®
Xeon™ dual core processors
–
2 processor sockets LGA771 for Intel
®
Xeon™ processor
–
2x2 or 4 MB second level cache (on-die unified, 64 byte cache-line size)
–
24 KB L1 cache (on-die, data)
–
16 KB L1 cache (on-die, instruction)
–
2xVRM 11.0 onboard (EVRD)
Main memory
–
8 slots for main memory FBD533/PC2-4200F or FBD667/PC2-5300 Fully
Buffered DIMM memory modules with 512 MB, 1 Gbyte, 2 Gbyte and 4
Gbyte
–
maximum 32 Gbyte of memory
–
minimum 1 Gbyte (2 memory modules)
–
maximum 32 Gbyte/s bandwidth
–
supports 4 way interleaved memory subsystems (4 identical memory
modules have to installed at the same time)
–
ECC multiple bit error detection and single bit error correction
–
memory scrubbing function
–
Single Device Data Correction (SDDC) function (Chipkill™)
–
Hot-spare memory support
Chips on the system board
–
Intel
®
Blackford Chipset
–
Dual-channel Broadcom LAN controller (BCM5715)
–
LSI 8-channel SAS controller (LSI SAS1068)
–
Flash for SAS-BIOS and NVRAM for integrated mirroring
–
Flash and NVRAM for RAID
–
Integrated VGA controller with PCI 32 Bit/33 MHz
–
Super I/O controller (SMSC DME1737)
–
Flash EPROM for:
–
SCSI-BIOS
–
BIOS
–
LAN