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Copyright © Future Technology Devices International Limited
Datasheet
Vinculum-II Embedded Dual USB Host Controller
IC
Version 1.6
Document No.: FT_000138 Clearance No.: FTDI# 143
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (T
s
to T
p
)
3°C / second Max.
3°C / Second Max.
Preheat:
- Temperature Min (T
s
Min.)
- Temperature Max (T
s
Max.)
- Time (t
s
Min to t
s
Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature T
L
:
- Temperature (T
L
)
- Time (t
L
)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (T
p
)
260°C
Time within 5°C of actual Peak
Temperature (t
p
)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature, T
p
8 minutes Max.
6 minutes Max.
Table 11.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0
°
C
220 +5/-0
°
C
≥ 2.5 mm
220 +5/-0
°
C
220 +5/-0
°
C
Pb Free (green material) = 260 +5/-0 °C
Table 11.2 Package Reflow Peak Temperature
