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Copyright © Future Technology Devices International Limited
Datasheet
Vinculum-II Embedded Dual USB Host Controller
IC
Version 1.6
Document No.: FT_000138 Clearance No.: FTDI# 143
11
Package Parameters
VNC2 is available in six RoHS Compliant packages, three QFN packages (64QFN, 48QFN & 32QFN) and
three LQFP packages (64LQFP, 48LQFP & 32LQFP). All packages are lead (Pb) free and use a ‘green’
compound. The packages are fully compliant with European Union directive 2002/95/EC.
The mechanical drawings of all six packages are shown in sections
– all dimensions are in
millimetres.
The solder reflow profile for all packages can be viewed in Section
11.1
VNC2 Package Markings
An example of the markings on each package are shown in
. The FTDI part number is too
long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line
as shown in
Line 4 - Date Code
YY - year year
WW - work week
XXXXXXXXXX
FTDl
YYWW
VNC2-64Q1A
Line 3 – FTDI Part Number
including revision. In this case it shows Rev
A. Please check for most recent revision.
Line 2 – Wafer Lot Number
Line 1 – FTDI Logo
Figure 11.1 Package Markings
XXXXXXXXXX
FTDl
1A YYWW
VNC2-32Q
Figure 11.2 Markings – 32 QFN
The last letter of the FTDI part number is the silicon revision number. This may change from A to B to C,
etc,. Please check the part number for the most recent revision.