© Freescale Semiconductor, Inc., 2004. All rights reserved.
Freescale Semiconductor
Technical Data
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
MC13192/D
Rev. 2.7, 12/2004
MC13192/MC13193
Package Information
Plastic Package
Case 1311-03
(QFN-32)
(Scale 1:1)
Ordering Information
Device
Device Marking
Package
MC13192
MC13193
13192
13193
QFN-32
QFN-32
1 Introduction
The MC13192 and MC13193 are short range, low
power, 2.4 GHz Industrial, Scientific, and Medical
(ISM) band transceivers. The MC13192/MC13193
contain a complete 802.15.4 physical layer (PHY)
modem designed for the IEEE
®
802.15.4 wireless
standard which supports peer-to-peer, star, and mesh
networking.
The MC13192 includes the 802.15.4 PHY/MAC for use
with the HCS08 Family of MCUs. The MC13193 also
includes the 802.15.4 PHY/MAC plus the ZigBee
Protocol Stack for use with the HCS08 Family of MCUs.
With the exception of the addition of the ZigBee Protocol
Stack, the MC13193 functionality is the same as the
MC13192.
When combined with an appropriate microcontroller
(MCU), the MC13192/MC13193 provide a
cost-effective solution for short-range data links and
networks. Interface with the MCU is accomplished using
a four wire serial peripheral interface (SPI) connection
and an interrupt request output which allows for the use
of a variety of processors. The software and processor
MC13192/MC13193
2.4 GHz Low Power Transceiver
for the IEEE
®
802.15.4 Standard
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 3
4 Data Transfer Modes . . . . . . . . . . . . . . . . . . . 3
5 Electrical Characteristics . . . . . . . . . . . . . . . 8
6 Functional Description . . . . . . . . . . . . . . . . 11
7 Pin Connections . . . . . . . . . . . . . . . . . . . . . . 14
8 Applications Information . . . . . . . . . . . . . . . 17
9 Packaging Information . . . . . . . . . . . . . . . . . 21