USER MANUAL
DUO mXTEND
TM
(NN03-320)
Last updated on July 2019
© 2019 FRACTUS ANTENNAS, S.L. -
14
The DUO mXTEND
TM
antenna booster (NN03-320) can be assembled following the Pb-free
assembly process. According to the Standard
IPC/JEDEC J-STD-020C
, the temperature profile
suggested is as follows:
Phase
Profile features
Pb-Free Assembly (SnAgCu)
RAMP-UP
Avg. Ramp-up Rate (Tsmax to Tp)
3 ºC / second (max.)
PREHEAT
-
Temperature Min (Tsmin)
-
Temperature Max (Tsmax)
-
Time (tsmin to tsmax)
150 ºC
200 ºC
60-180 seconds
REFLOW
-
Temperature (TL)
-
Total Time above TL (tL)
217 ºC
60-150 seconds
PEAK
-
Temperature (Tp)
-
Time (tp)
260 ºC
20-40 seconds
RAMP-DOWN
Rate
6 ºC/second max
Time from 25 ºC to Peak Temperature
8 minutes max
Table 4
–
Recommended soldering temperatures.
Next graphic shows temperature profile (grey zone) for the DUO mXTEND
TM
antenna booster
assembly process reflow ovens.
Figure 10
–
Temperature profile.
