USER MANUAL
DUO mXTEND
TM
(NN03-320)
Last updated on July 2019
© 2019 FRACTUS ANTENNAS, S.L. -
13
1
Mounting Pads (1, 2)
: the DUO mXTEND
TM
antenna booster mounting pads to the soldering
process on the PCB. These pads should be grounded
2
3
4
Feed Pads:
Pad (4) is used as feed pad for GPS/GLONASS/GALILEO/BeiDou
bands. In the same way, pad (3) is used as feed pad for Bluetooth band
5.
ASSEMBLY PROCESS
Figure 8 shows the back and front views of the DUO mXTEND
TM
antenna booster (NN03-320).
Figure 8
–
Pads of the DUO mXTEND
TM
antenna booster NN03-320.
As a surface mount device (SMD), the DUO mXTEND
TM
antenna booster is compatible with
industry standard soldering processes. The basic assembly procedure for the DUO mXTEND
TM
antenna booster is as follows:
1.
Apply a solder paste on the pads of the PCB. Place the DUO mXTEND
TM
antenna booster on
the board.
2.
Perform a reflow process according to the temperature profile detailed in Table 4, Figure 10.
3.
After soldering the DUO mXTEND
TM
antenna booster to the circuit board, perform a cleaning
process to remove any residual flux. Fractus Antennas recommends conducting a visual
inspection after the cleaning process to verify that all reflux has been removed.
The drawing below shows the soldering details obtained after a correct assembly process:
Figure 9
–
Soldering Details.
NOTE(*):
Solder paste thickness after the assembly process will depend on the thickness of the
soldering stencil mask. A stencil thickness equal or larger than
127 microns (5 mils)
is
required.
DUO
mXTEND
TM
chip antenna
component
PCB
Solder Paste
DUO
mXTEND
TM
chip antenna component
PCB
~ 0.1* mm
