FS453/4 AND FS455/6
DATA SHEET: HARDWARE REFERENCE
6°C/sec max.
Max. 220 +5, -0 °C
10sec ±3sec
60~150sec
(Over 183°C)
3°C/sec Max.
140~160°C
60~120sec
3°C/sec Max.
Max. 225°C
Cooling down(F)
Re-flow peak(E)
Maintain(D)
Heat-up(C)
Pre-heat(B)
Heat-up(A)
Peak Temp.
IR Re-flow Profile for Pre-conditioning
100
200
300
°C
B
C
D
E (Peak Temperature 220°C +5, -0 °C)
A
F
sec
IR Re
IR Re
-
-
flow Profile
flow Profile
Figure 16 FBGA Package (Lead Solder)
Moisture Absorption Condition : 30
Moisture Absorption Condition : 30
°
C/60%RH, 192hrs
C/60%RH, 192hrs
IR sequence : Bake
IR sequence : Bake
-
-
Absorption
Absorption
-
-
IR 3 times
IR 3 times
IR Re-flow Profile & Moisture Absorption Condition
100
200
300°C
B
C
D
E (Peak Temperature 260°C)
A
F
sec
6°C/sec Max.
Max. 260°C
255°C+5, -0°C
10 ±3sec
3°C/sec Max.
160~190°C
90 ±30sec
3°C/sec Max.
Max. 260°C
Cooling down(F)
Re-flow peak(E)
Maintain(D)
Heat-up(C)
Pre-heat(B)
Heat-up(A)
Peak Temp.
IR Re-flow Profile for Pre-conditioning
Figure 17 PQFP or FBGA Package (Lead-Free Solder)
JANUARY, 2005, VERSION 3.0
39
COPYRIGHT
©
2003-4 FOCUS ENHANCEMENTS, INC.
FOCUS Enhancements Semiconductor
