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Fibocom L860-GL-16 Hardware Manual Download Page 33

 

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. 

FIBOCOM L860-GL Series Hardware Guide 

 

 

 

 

 

 

 

 

 

 

 

Page 33 of 60 

+3.3V

PERST#

RESET#

Module State

D3

cold

 L2@S0/S0ix

D0 L0@S0/S0ix

FCPO#

D0 L0@S0/S0ix

PEWAKE#

Host assert

Host de-assert

CLKREQ#

 

Figure 3-11 D3

cold

 L2 timing (Host wakeup) 

 

+3.3V

PERST#

RESET#

Module State

D3

cold

 L2@S0/S0ix

D0 L0@S0/S0ix

FCPO#

D0 L0@S0/S0ix

PEWAKE#

Modem assert

Host  de-assert

Modem de-assert

Host  assert

CLKREQ#

Figure 3-12 D3

cold

 L2 timing (Modem wakeup) 

 

 

 

 

 

 

Fibocom 

Confidential

Summary of Contents for L860-GL-16

Page 1: ...FIBOCOM L860 GL 16 Hardware Guide Version 1 0 0 Date 2020 09 28 F i b o c o m C o n f i d e n t i a l...

Page 2: ...without Fibocom Wireless Inc written authorization All Rights Reserved FIBOCOM L860 GL Series Hardware Guide Page 2 of 60 Applicability Type No Product Model Description 1 L860 GL 16 NA F i b o c o m...

Page 3: ...configurations 4 For FCC Part 15 31 h and k The host manufacturer is responsible for additional testing to verify compliance as a composite system When testing the host device for compliance with Part...

Page 4: ...transmitter or antenna 3 Only antennas of the same type and with equal or less gains as shown below may be used with this module Other types of antennas and or higher gain antennas may require additi...

Page 5: ...n which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one of the following measures Reorient or relocate the receiving antenna Incr...

Page 6: ...er or antenna As long as 2 conditions above are met further transmitter test will not be required However the OEM integrator is still responsible for testing their end product for any additional compl...

Page 7: ...bocom Wireless Inc written authorization All Rights Reserved FIBOCOM L860 GL Series Hardware Guide Page 7 of 60 Change History Version Author Date Remark V1 0 0 Shu Ying 2020 09 28 Draft version F i b...

Page 8: ...onfiguration 16 3 Application Interface 17 3 1 M 2 Interface 17 Pin Map 17 Pin Definition 18 3 2 Power 22 Power Supply 23 Logic Level 24 Power Consumption 25 3 3 Control Signal 26 Module Start Up 27 3...

Page 9: ...C Pins 44 4 Radio Frequency 45 4 1 RF Interface 45 RF Interface Functionality 45 RF Connector Characteristic 45 RF Connector Dimension 45 RF Connector Assembly 47 4 2 Operating Band 48 4 3 Transmittin...

Page 10: ...and reception TDD 3GPP TS 36 521 1 V13 4 0 User Equipment UE conformance specification Radio transmission and reception Part 1 Conformance testing 3GPP TS 21 111 V10 0 0 USIM and IC card requirements...

Page 11: ...pport Band 2 4 7 25 30 38 41 48 66 WCDMA HSPA Band 2 4 5 GNSS Support GPS BDS GLONASS Galileo LTE 3GPP Release 13 UMTS 3GPP Release 12 Data Transmission LTE FDD LTE FDD 1Gbps DL Cat 16 50Mbps UL Cat 1...

Page 12: ...SAR LED Tunable antenna UART Software Protocol Stack IPV4 IPV6 AT Commands 3GPP TS 27 007 and 27 005 Firmware Update PCIe Other Feature Multiple carrier Windows MBIM support Windows update OS Windows1...

Page 13: ...ous plus inter band 2 2 5 2 2 12 2 2 13 2 2 30 2 2 66 2 4 4 2 46 46 2 66 66 2 2 4 2 2 14 2 2 71 2 2 46 4 4 5 4 4 12 4 4 13 4 46 46 5 66 66 4 4 7 5 5 66 5 48 48 12 66 66 13 66 66 46 46 66 29 66 66 30 6...

Page 14: ...us 48 41 5CA 2 intra band contiguous plus 2 intra band contiguous plus inter band 2 46 46 46 46 46 46 46 46 66 2 5 5 66 66 13 48 48 66 66 48 4 8 48 66 66 2 intra band contiguous plus 3 inter band 2 5...

Page 15: ...Host application D G AUX1 ANT Main ANT SIM Card PCIe e SIM M2 AUX3 ANT M1 AUX2 ANT Figure 2 1 Application framework 2 5 Hardware Block Diagram The hardware block diagram in Figure 2 2 shows the main...

Page 16: ...EM Div LB FEM GNSS LNA RF SAW GNSS Extractor Tiplexer GNSS SAW Div RX 4th Div RX 3rd Div RX SAW LPDDR4 RAM DigRF RX TCXO VDD_IO_1V8 GPIO 3 3V FULL_CARD_POWER_OFF RESET PCIe USB2 0 USB3 0 USIM1 EINT WO...

Page 17: ..._RXD 1 8V COEX3 1 8V RFE_RFFE_SDATA Notch LED1 3 3V OD W_DISABLE1 3 3 1 8V FULL_CARD_POWER_OFF 3 3 1 8V 3 3V PEWAKE 3 3V CLKREQ 3 3V PERST 3 3V NC 20 USB D GND GND 3 3V UIM1_RESET UART_RX 1 8V mux for...

Page 18: ..._OFF I PU Power enable module power on input internal pull up 3 3 1 8V 7 USB D I O USB data plus only for debug 0 3 3V 8 W_DISABLE1 I PD WWAN disable active low 3 3 1 8V 9 USB D I O USB data minus onl...

Page 19: ...TX O USB3 0 transmit data minus only for debug 30 UIM_RESET O L SIM reset signal 1 8V 3V 31 USB3 0_TX O USB3 0 transmit data plus only for debug 32 UIM_CLK O L SIM clock signal 1 8V 3V 33 GND GND Powe...

Page 20: ...vice to request a PCIe reference clock be available active clock state in order to transmit data It also used by L1 PM Sub states mechanism asserted by either host or device to initiate an L1 exit Act...

Page 21: ...COEX_TXD O T Wireless coexistence between WWAN and WIFI BT modules based on BT SIG coexistence protocol UART transmit signal WWAN module side Reserved 1 8V 65 ANTCTL3 O PD Tunable ANT CTRL3 1 8V 66 S...

Page 22: ...ing 3 2 Power The power interface of L860 module is shown in the following table Pin Pin Name I O Pin Description DC Parameter V Minimum Value Typical Value Maximum Value 2 4 70 72 74 3 3V PI Power su...

Page 23: ...stabilizing capacitors Reduce power fluctuations of the module in operation requiring capacitors with low ESR LDO or DC DC power supply requires the capacitor of no less than 440uF The capacitor for b...

Page 24: ...hould not be lower than 3 135V otherwise module may shut down or restart The power supply requirement is shown in Figure 3 3 Burst transmit Burst transmit min 3 135V Power supply Ripple 300mV Drop VBA...

Page 25: ...AT CFUN 4 flight mode 2 8 IWCDMA RMS WCDMA WCDMA Data call Band 2 23 5dBm 730 WCDMA Data call Band 4 23 5dBm 800 WCDMA Data call Band 5 23 5dBm 580 ILTE RMS LTE FDD LTE FDD Data call Band 2 23dBm 960...

Page 26: ...13 46 46 46 2 46 46 46 46 2 46 46 46 66 4 46 46 46 46 5 46 46 46 66 13 46 46 46 66 46 46 46 66 66 2 46 46 46 46 5 46 46 46 46 13 46 46 46 46 41 41 41 41 41 Band 2 22dBm 1650 Band 5 22dBm 1300 Band 7 2...

Page 27: ...be neither near PCB edge nor route on surface layer to avoid module abnormal reset caused by ESD Module Start Up 3 3 1 1 Start up Circuit The FCPO FULL_CARD_POWER_OFF pin needs an external 3 3V or 1 8...

Page 28: ...wn The module can be shut down by the following controls Shutdown Control Action Condition Software Sending AT CFUN 0 command Normal shutdown recommend Hardware Pull down FCPO pin Only used when a har...

Page 29: ...be asserted after PERST toff2 2ms 10ms FCPO should be asserted after RESET tpd 10ms 100ms 3 3V power supply goes down time If power supply is always on it can be ignored Module Reset The L860 module...

Page 30: ...U of module internal always on in reset sequence recommend using in FW upgrade and module recovery Reset timing 2nd in Figure 3 9 PMU of module internal will be off in reset sequence including whole p...

Page 31: ...well as Runtime flow ton1 8ms 20ms RESET should be de asserted after FCPO refer section 3 3 1 2 ton2 50ms 100ms The time delay of PERST de asserted after FCPO PERST must always be the last to get de a...

Page 32: ...KREQ pull down 3 3 4 1 D0 L1 2 Module supports PCIe goes into D0 L1 2 state in Win10 system The D0 D0 L1 2 S0 S0ix D0 timing is shown in Figure 3 10 3 3V PERST RESET Module State D0 L1 2 S0 S0ix D0 L0...

Page 33: ...State D3cold L2 S0 S0ix D0 L0 S0 S0ix FCPO D0 L0 S0 S0ix PEWAKE Host assert Host de assert CLKREQ Figure 3 11 D3cold L2 timing Host wakeup 3 3V PERST RESET Module State D3cold L2 S0 S0ix D0 L0 S0 S0ix...

Page 34: ...le above AMD X86 platforms should follow the table above and meet the special request of platform itself The recommended timing application in Chrome Android Linux OS is as below table System status T...

Page 35: ...ve 50 PERST I PU Asserted to reset module PCIe interface default If module went into coredump it will reset whole module not only PCIe interface Active low internal pull up 10K 3 3V 52 CLKREQ I O PU A...

Page 36: ...ifferential signal lines go through different layers the via hole of grounding signal should be in close to that of signal and generally each pair of signals require 1 3 grounding signal via holes and...

Page 37: ...equired for all parts When the length match is conducted for the differential lines the designed position of correct match should be close to that of incorrect match as shown in Figure 3 14 However th...

Page 38: ...ect internal 390K pull up Active high and high level indicates SIM card is inserted and low level indicates SIM card is detached 1 8V USIM Interface Circuit 3 5 2 1 N C SIM Card Slot The reference cir...

Page 39: ...le supports the SIM card hot plug function which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot The SIM card hot plug function can b...

Page 40: ...g housing can improve the anti interference ability The trace length between the SIM card slot and the module should not exceed 100mm or it could reduce the signal quality The UIM_CLK and UIM_DATA sig...

Page 41: ...age and the driving current WOWWAN The WOWWAN signal is used to wake the Host AP when there comes the data request The definition of WOWWAN signal is as follows Operating Mode WOWWAN Signal SMS or dat...

Page 42: ...W_DISABLE1 signal is as below table W_DISABLE1 Signal Function High Floating WWAN function is enabled the module exits the flight mode Low WWAN function is disabled the module enters flight mode Note...

Page 43: ...D G ANT Reserved Low Support 4 antennas Reserved 3 8 ANT Tunable Interface The module supports ANT Tunable interfaces with two different control modes i e MIPI interface and 4bit GPO interface Through...

Page 44: ...O NC The M 2 module configuration is shown in the following table Config_0 pin21 Config_1 pin69 Config_2 pin75 Config_3 pin1 Module Type and Main Host Interface Port Configuration NC GND NC NC WWAN P...

Page 45: ...transmit RF signal D G is for Diversity antenna which is used to receive the diversity RF signal M1 and M2 are used for support 4x4 MIMO data transfer Figure 4 1 RF connectors RF Connector Characteri...

Page 46: ...s Reserved FIBOCOM L860 GL Series Hardware Guide Page 46 of 60 following picture Figure 4 2 RF connector dimensions Figure 4 3 0 81mm coaxial antenna dimensions Figure 4 4 Schematic diagram of 0 81mm...

Page 47: ...RF connector parallel refer Figure 4 5 do not slant mate with strong force Figure 4 5 Mate RF connector To avoid damage in RF connector unmating it is recommended using pulling JIG as Figure 4 6 and t...

Page 48: ...TE FDD WCDMA 1850 1910 1930 1990 Band 4 1700MHz LTE FDD WCDMA 1710 1755 2110 2155 Band 5 850MHz LTE FDD WCDMA 824 849 869 894 Band 7 2600Mhz LTE FDD 2500 2570 2620 2690 Band 12 700MHz LTE FDD 699 716...

Page 49: ...r The transmitting power for each band of L860 module is shown in the following table Mode Band 3GPP Requirement dBm Tx Power dBm Note WCDMA Band 2 24 1 7 3 7 23 5 1 Band 4 24 1 7 3 7 23 5 1 Band 5 24...

Page 50: ...vity All bands support dual antennas the receiver sensitivity for each band of L860 module is shown in below table Mode Band 3GPP Requirement dBm Rx Sensitivity dBm Typical Note WCDMA Band 2 104 7 110...

Page 51: ...eiver Sensitivity Some middle high bands support four antennas The receiver sensitivity for some middle high bands of L860 module is shown in below table Mode Band Middle High Band 3GPP Requirement dB...

Page 52: ...racking 80mA 130dBm 65mA 130dBm GPS Sleep 3 5mA 2mA GPS GLONASS BDS Sleep 3 5mA 2mA TTFF GPS Cold start 45s 35s 130dBm Warm start 45s 33s 130dBm Hot Start 3s 1s 130dBm GPS GLONASS BDS Cold start 45s 3...

Page 53: ...E Band 13 700 41 MHz LTE Band 14 700 40 MHz LTE Band 17 700 42 MHz LTE band 25 1900 145 MHz LTE band 26 850 80 MHz LTE band 29 700 12 MHz LTE band 30 2300 55 MHz LTE band 66 1700 490MHz LTE band 38 26...

Page 54: ...D sensitive components should be strictly followed Proper ESD handling procedures must be applied throughout the processing handling assembly and operation of any application with module The ESD chara...

Page 55: ...of 60 6 Structure Specification 6 1 Product Appearance The product appearance for L860 module is shown in Figure6 1 Figure 6 1 Module appearance Note The label of each module is subject to the good s...

Page 56: ...module adopts 75 pin gold finger as external interface where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3 1 For module dimension please refer to 6 2 Dimension of Structure Ba...

Page 57: ...interface model 6 4 M 2 Connector L860 module connects with host by M 2 connector which is built in host The recommended part number is APCI0026 P001A manufactured by LOTES Corporation and the dimensi...

Page 58: ...tray sealed packing combined with the outer packing method using the hard cartoon box so that the storage transportation and the usage of modules can be protected to the greatest extent Note The modu...

Page 59: ...ion forbidden without Fibocom Wireless Inc written authorization All Rights Reserved FIBOCOM L860 GL Series Hardware Guide Page 59 of 60 Figure 6 5 Tray packaging process F i b o c o m C o n f i d e n...

Page 60: ...eries Hardware Guide Page 60 of 60 Tray Size The pallet size is 315 170 6 5mm and is shown in Figure 6 6 Figure 6 6 Tray size unit mm ITEM DIM Unit mm L 315 0 2 0 W 170 0 2 0 H 6 5 0 3 T 0 8 0 1 A 43...

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