CPC309 Intel Atom D510-based SBC
Specification
4.2 Possible Heat Removal Methods
The Appendix cites technical requirements the user must take into account while developing
his own cooling system. Temperature should be controlled with the help of a thermal sensor.
Heat removal methods are shown on the figure below.
Fig. 4-1: Heat removal methods
There is a heat sink installed on the bottom side of the
CPC309 module. With such a configuration, it is possible to ensure heat dissipation by installing
the module directly onto a body or a chassis (the body plays the role or a large
radiator). Heat is removed from the CPU and the ICH8 microchip with the help of a heat sink
and transferred to the PC/104 module body.
A ribbed radiator may be additionally installed onto the
CPC309 module (ACS00035-01 from among additional accessories). The radiator is installed
on the heat sink (with the help of thermal compound) and fastened with the screws supplied
with the radiator.
Images on the figures may be slightly different from your module.
4.3 Procedure of CPC309 Installation
In order to install the CPC309 module into a system, follow the procedure described below:
1. Make sure that the safety requirements listed in Section 4.1 have been observed.
Attention!
Non-observance of the following instructions may cause damages to the module and incorrect
operation of the system.
2. Before installing make sure that the module has been configured as per Section 5
(information about the CPC309 module configuration is provided in Section 5 of this
Manual). Information about installing peripheral devices, expansion modules and
input/output devices is provided in the respective paragraphs of Section 4.5 of this Manual.