EVOC MEC-5071-M Series, Manual

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Product Installation
· 14 · MEC-5071-M SERIES
3.3 Application Environment of Fully-enclosed Computer
Dissipation methods of fully-enclosed computer: thermal conduction and thermal
radiation methods are deployed to dissipate heat generated by internal components to
the chassis, which in turn passes the heat to the external space by thermal radiation
and convection. The inside of the chassis, the chassis and the space where the
computer is located exchange heat with each other continuously and sufficiently. The
requirements for the working area or space where the PC is located are as follows:
The largest dimension of the fully-enclosed PC is L, the gravity direction is Y, the
upper space of the PC is +Y, while the lower space of the PC is –Y, as shown in the
Picture 1 and Picture 2 below.
1. Upper space +Y > 2L: above the PC, there should be a space at least twice the
largest dimension of the PC;
2. Low space -Y > L: below the PC, there should be a space at least the same size as
the largest dimension of the PC;
3. There should be at least 0.5L space for the other four directions (front, rear, left,
right);
4. In the above heat exchange areas, there should be no other heat generating object or
space divider, and no other article is allowed to be placed on the surface of chassis;
5. There should be heat exchange channel between heat exchange area and outside
natural environment, such as air moving equipment, and air inlet/outlet to ensure air
circulation, etc.;
6. The temperature of lower space (20 ～ 50mm from the bottom of the PC) should be
no more than the rated operating environment temperature of the PC;
7. At any point in the heat exchange area, the air flow speed should not be lower than
0.2m/s.