C5621 and C33 User Guide
1/1553-KRD 131 24 Uen Rev D 2011-11-22
Ericsson AB 2011
16 (37)
Ericsson Confidential
5
Production Guideline
5.1
Package type
C5621 / C33 module has ENIG bottom terminations with a LGA design; no
solder mask is present at the underside of the package.
Figure 4, Top view of C5621/C33
5.2
Floor life and dry storage
The CE module should be stored in a dry pack and handled according to
IPC/JEDEC J-STD-033B.1, MSL 3
with bake at:
•
125 °C, when supplied on JEDEC tray
•
40 °
C ≤5% RH when supplied on 44 mm tape and reel
5.3
Screen stencil design
Material:
Stainless steel
Thickness:
0.1 mm (~4 mil)
Aperture size:
Ø 0.63 mm (277x)
All solder paste deposits should be centered on the PCB.
5.4
Assembly
Pick-up position should be centered on the package topside.
Nozzle Ø: 10-20 mm
