
C5621 and C33 User Guide
1/1553-KRD 131 24 Uen Rev D 2011-11-22
Ericsson AB 2011
11 (37)
Ericsson Confidential
3
Hardware Overview
3.1
General
C5621 and C33 have a form factor of 29 x 29 x 1.9 mm, soldered in board.
The pin out is configured as a 277 pin LGA (Land Grid Array). The ball
diameter is 0.63 mm and the pitch is 1.27 mm. The pin configuration is shown
in the picture below.
4
Routing guidelines
C5621 / C33 Mobile Broadband module is an LGA subassembly, soldered to
the host board, and shares GND plane with the host platform, it is essential
that the host board layout follows the recommendation given in this chapter to
get the best performance out of the module.