S1C63558 TECHNICAL MANUAL
EPSON
171
CHAPTER 9: PAD LAYOUT
CHAPTER
9 P
AD
L
AYOUT
9.1 Diagram of Pad Layout
Chip thickness: 400 µm
Pad opening:
100 µm
X
Y
(0, 0)
4.01 mm
4.50 mm
1
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Die No.