EPOX EP-BX3, Manual, Page: 9 / 68

Introduction EP-BX3
Page 1-3
packaging technology and each of the physical elements of the product are referred to
using accurate technical descriptions. This allows clear reference to the products as
just a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium
®
II or Pentium
®
III Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro
processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge
in place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide added
support for heatsinks.
The L2 cache (TagRAM,
PBSRAM) components keep
standard industry names.
The Pentium
®
II or Pentium
®
III
Processor is the first product to
utilize the S.E.C. cartridge technol-
ogy and Slot 1 connector. Unless
otherwise noted, any references to
“Pentium
® II Processor,”
Figure 1: Pentium
®
II/III Processor CPU
with S.E.C.C. or S.E.C.C.2 Package
Pentium
®
II Processor
in an S.E.C.C. Package
Pentium
®
III Processor
in an S.E.C.C.2 Package