SMD NTC Thermistor
B57620C5103*062
SMD NTC Thermistor with Ni-Barrier Termination
SEN NTC PD
2009-01-12
Please read Cautions and warnings and
Page 6 of 13
Important notes at the end of this document
.
Mounting Instructions
1. Termination
Ni-barrier termination (Ag/Ni/Sn)
2. Recommended geometry of solder pads
Size A
[mm]
B
[mm]
C
[mm]
D
[mm]
0805 1.3 1.2 1.0 3.4
3. Requirements for Solderability
- Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Wetting of soldering areas
≥
95%.
Pb-containing solder:
Sn(60)Pb(40)
Bath temperature (°C): 215
±
3
Dwell time (s): 3
±
0.3
Pb-free solder:
Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 245
±
5
Dwell time (s): 3
±
0.3
A
A
D
C
B
B
Inner electrode
Base layer - silver
Diffusion barrier - nickel
Outer layer - tin
