USER MANUAL
TCM 410J
–
Transceiver Module
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TCM 410J User Manual | v2.3 | June 2022 | Page 37 / 46
Solder paste top layer
The data above are also available as EAGLE library.
To ensure good solder quality a solder mask thickness of 150 µm is recommended.
If a 120 µm solder mask is used, then it is recommended to enlarge the solder print. The
pads on the solder print should then be 0.1 mm larger than the pad dimensions of the
module.
An application and production specific test regarding the amount of soldering paste should
be performed to find optimum parameters.