5.1 Carrier board recommended specifications
Following we'll describe the specifications required to carrier board to avoid problems of assembly process. The module is interfaced
with the carrier board through a SO-DIMM with 200 positions connector type TYCO ELECTRONICS code 1473005-1 or compatible.
For proper assembly is strongly recommended to paying attention to:
5.1.1 Planarity in finish process
Due to the technical and mechanical specifications of the connector we suggest the maximum planarity of the footprint on PCB, so we
suggest a type of finish obtained by horizontal process ( we suggest and use for our carrier boards a type Chemical Gold finish).
5.1.2 Planarity of PCB
Also the planarity of the entire Printed Circuit Board must be kept in check especially when the your carrier board grows in size. In this
case we suggest you contact the manufacturer of PCB to understand how improve the planarity of ended board and optimize the
process maintaining the electrical characteristics unchanged
Note: for further detail please refer to your SO-DIMM connector's data-sheet
5.1.3 Power Supply
It's strongly recommended that the power supply of the carrier board, which feeds the driver and control devices connected with the
i.MX processor, begins to work after the initialization of the processor itself
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