Dipfit W CLA111
Maintenance
Hauser
19
5
Maintenance
#
Warning!
Risk of injury!
Before starting maintenance work on the assembly, make sure that the process line and the tank are
depressurized, empty and rinsed.
5.1
Maintaining the assembly
To ensure a reliable measurement perform the following maintenance work:
• Replace damaged assembly parts.
• Keep O-rings and sealing surfaces clean.
• Replace damaged O-rings (apply a thin layer of grease to new or dry O-rings (e.g. Syntheso Glep)).
• Remove deposits from time to time.
5.2
Cleaning the sensor
You have to clean the sensor:
• before every calibration
• regularly during operation
• before being returned for repair
You can remove and clean the sensor manually or perform a cyclical cleaning operation with the
automatic cleaning system Chemoclean. A complete cleaning system consists of:
• Spray head CLR30
• Cleaning injector CYR10
• Cleaning control, e.g. program sequencer CYR20 or internally via transmitter Mycom CLM153
or Liquisys M CLM223/253 with "Plus Package".
5.3
Cleaning agents
The selection of the cleaning agent is dependent on the degree and type of contamination. The most
common contaminations and the suitable cleaning agents are listed in the following table.
"
Caution!
Do not use organic solvents containing halogen or acetone. These solvents could destroy plastic
components of the assembly or the sensor and it is also partly suspected that they cause cancer
(e.g. chloroform).
Type of contamination
Cleaning agent
Greases and oils
Hot water or tempered substances containing tensides (alkaline) or
water-soluble organic solvents (e.g. ethanol)
Calciferous deposits, metal hydroxide deposits,
lyophobic biological deposits
Approx. 3% hydrochloric acid
Sulphide deposits
Mixture of 3% hydrochloric acid and thiocarbamide (commercially
available)
Protein deposits
Mixture of 3% hydrochloric acid and pepsin (commercially
available)
Fibers, suspended substances
Water under pressure, poss. with surface-active agents
Light biological deposits
Water under pressure
