Emerson Copeland CORESENSE, Technical Information

Page: 1 / 18

D7.8.6/1112-0815/E 1/18
Date of last update: Aug-15 Ref: D7.8.6/1112-0815/E
Application Engineering Europe
C
ORE
S
ENSE
™ D
IAGNOSTICS FOR
C
OPELAND
™ S
TREAM
C
OMPRESSORS
M
ODBUS
® S
PECIFICATION
CoreSense
™ Diagnostics for Copeland™ Stream Compressors Modbus® Specification .......................................... 1
1 Introduction ...................................................................................................................................................... 3
1.1 Abbreviations ........................................................................................................................................... 3
1.1 Intent ........................................................................................................................................................ 3
1.2 Scope ....................................................................................................................................................... 3
1.3 References .............................................................................................................................................. 3
2 General description .......................................................................................................................................... 3
3 Modbus type identification ............................................................................................................................... 4
3.1 Modbus with 10 DIP-switch ..................................................................................................................... 4
3.2 Modbus with 12 DIP-switch
– New version ............................................................................................. 5
3.3 DIP-Switch functions ............................................................................................................................... 5
4 Physical layer ................................................................................................................................................... 6
4.1 Topology .................................................................................................................................................. 6
4.1.1 Wire used .................................................................................................................................................. 6
4.1.2 Bus bias .................................................................................................................................................... 6
4.1.3 Termination ............................................................................................................................................... 6
4.2 Data signalling rates ................................................................................................................................ 6
4.2.1 Baud rate selection ................................................................................................................................... 6
4.2.2 Parity selection .......................................................................................................................................... 6
4.3 Labelling .................................................................................................................................................. 7
4.4 Connectors .............................................................................................................................................. 7
4.5 Wiring and connections ........................................................................................................................... 7
5 Data Link layer ................................................................................................................................................. 8
5.1 Node address .......................................................................................................................................... 8
5.2 DIP-Switch settings ................................................................................................................................. 9
5.3 RTU Transmission mode ....................................................................................................................... 10
5.4 Response message timeout .................................................................................................................. 10
6 Application layer............................................................................................................................................. 10
6.1 Available functions ................................................................................................................................. 10
6.2 Data types .............................................................................................................................................. 10
6.3 Functions supported .............................................................................................................................. 10
6.3.1 Coil input status ...................................................................................................................................... 10