Wireless UART Module User Manual of E64 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd.
14
/
16
9.
Production Guidance
9.1 Reflow Soldering Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time(tL)Maintained Above(TL)
60-90 sec
30-90 sec
Peak temperature(Tp)
220-235℃
230-250℃
Aveage ramp-down rate(Tp to Tsmax)
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max