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Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP2 User Manual

Copyright ©2012–2020

Chengdu Ebyte Electronic Technology Co., Ltd

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Contents

Disclaimer...............................................................................................................................................................................2
Chapter1. Overview................................................................................................................................................................3

1.1 Brief introduction......................................................................................................................................................3
1.2 Features.....................................................................................................................................................................3
1.3 Application................................................................................................................................................................3

Chapter2. Specifications......................................................................................................................................................... 4

2.1 Limit parameter .......................................................................................................................................................4
2.2 Operating parameter.............................................................................................................................................. 4

Chapter3. Size and pin definition.......................................................................................................................................... 5
Chapter4. Basic operation.......................................................................................................................................................6

4.1 Hardware design....................................................................................................................................................... 6
4.2 Software editing........................................................................................................................................................7

Chapter5. Circuit diagram.......................................................................................................................................................8
Chapter6. FAQ........................................................................................................................................................................ 8

6.1 Communication range is too short............................................................................................................................8
6.2 Module is easy to damage.........................................................................................................................................8
6.3 BER(Bit Error Rate) is high...................................................................................................................................9

Chapter7. Soldering guidance.................................................................................................................................................9

7.1 Reflow soldering temperature...................................................................................................................................9
7.2 Reflow soldering curve...........................................................................................................................................10

Chapter8. Related models.....................................................................................................................................................10
Chapter9. Antenna Guide......................................................................................................................................................10
Chapter10. Antenna selection............................................................................................................................................... 11
Chapter11. Bulk packaging...................................................................................................................................................12
Revision history.................................................................................................................................................................... 12
About us................................................................................................................................................................................13

Summary of Contents for E01C-ML01SP2

Page 1: ...E01C ML01SP2 User Manual SI24R1 2 4GHz 100mW SPI SMD wireless module ...

Page 2: ...ameter 4 Chapter3 Size and pin definition 5 Chapter4 Basic operation 6 4 1 Hardware design 6 4 2 Software editing 7 Chapter5 Circuit diagram 8 Chapter6 FAQ 8 6 1 Communication range is too short 8 6 2 Module is easy to damage 8 6 3 BER Bit Error Rate is high 9 Chapter7 Soldering guidance 9 7 1 Reflow soldering temperature 9 7 2 Reflow soldering curve 10 Chapter8 Related models 10 Chapter9 Antenna ...

Page 3: ...oduction use modification or disclosure to third parties of this document or any part thereof without the express permission of EBYTE is strictly prohibited The information contained herein is provided as is and EBYTE assumes no liability for the use of the information No warranty either express or implied is given including but not limited with respect to the accuracy correctness reliability and ...

Page 4: ... transceiver module it needs to use MCU driver or use a dedicated SPI debugging tool 1 2 Features Ultra small size only 12 8x25mm RFX2401C power amplifier scheme the maximum transmission power is 100mW and the software is multi level adjustable Under ideal conditions the communication distance can reach 1 8km At the same time it has PCB onboard antenna and IPX interface users can choose to use acc...

Page 5: ...ormance Remark Min Typ Max Operating voltage V 2 0 3 3 3 6 3 3V ensures output power Communication level V 3 3 For 5V TTL it may be at risk of burning down Operating temperature 40 85 Industrial design Operating frequency GHz 2 4 2 525 Support ISM band Power consumptio n Tx current 120 Instantaneous power consumption Rx current 28 5 Sleep current μA 2 Software is shut down Max Tx power dBm 19 7 20...

Page 6: ...header Communication interface SPI 0 10Mbps Size 12 8 25mm With out SMA Antenna PCB IPEX The factory default PCB antenna the equivalent impedance is about 50Ω Chapter3 Size and pin definition Pin No Pin item Pin direction Pin application 1 VCC The power supply must be between 2 0 3 6V 2 CE Input Module control pin 3 CSN Input Module chip select pin used to start a SPI communication ...

Page 7: ...and power routing must be avoided under the module If it is necessary to pass through the module assume that the module is soldered to the Top Layer and the copper is spread on the Top Layer of the module contact part well grounded it must be close to the digital part of the module and routed in the Bottom Layer Assuming the module is soldered or placed over the Top Layer it is wrong to randomly r...

Page 8: ...controller and achieve fast response it can be disconnected and the interrupt status can be obtained by SPI query not recommended not conducive to overall power consumption and low efficiency CE can be connected to the high level for a long time but the module must be set to POWER DOWN power down mode when writing the register It is recommended that CE be controlled by the MCU pin The CE pin is co...

Page 9: ... setting is too high the higher the air speed the closer the distance The low voltage of the power supply at room temperature is lower than the recommended value the lower the voltage the lower the power output The poor matching degree of the antenna and the module or the quality of the antenna itself 6 2 Module is easy to damage Please check the power supply to ensure that it is within the recomm...

Page 10: ...igh bit error rates Chapter7 Soldering guidance 7 1 Reflow soldering temperature Profile Feature Curve characteristics Sn Pb Assembly Pb Free Assembly Solder Paste Solder paste Sn63 Pb37 Sn96 5 Ag3 Cu0 5 Preheat Temperature min Tsmin Min preheating temp 100 150 Preheat temperature max Tsmax Mx preheating temp 150 200 Preheat Time Tsmin to Tsmax ts Preheating time 60 120 sec 60 120 sec Average ramp...

Page 11: ...4L01 2 4G 0 100 SMD PCB E01 ML01D nRF24L01 2 4G 0 100 DPI PCB E01 ML01IPX nRF24L01 2 4G 0 200 SMD IPEX E01 2G4M13S nRF24L01 2 4G 13 1200 SMD PCB E01 ML01SP2 nRF24L01 2 4G 20 1800 SMD PCB IPEX E01 ML01SP4 nRF24L01 2 4G 20 2000 SMD IPEX E01 ML01DP4 nRF24L01 2 4G 20 1800 DPI PCB E01 ML01DP5 nRF24L01 2 4G 20 2500 DPI SMA K E01 2G4M27D nRF24L01 2 4G 27 5000 DPI SMA K All wireless modules of the E01 ser...

Page 12: ...aight omnidirectional antenna TX2400 JZ 5 Glue stick antenna 2 4G 2 0 50 SMA J Ultra short straight omnidirectional antenna TX2400 JW 5 Glue stick antenna 2 4G 2 0 50 SMA J Fixed bending omnidirectional antenna TX2400 JK 11 Glue stick antenna 2 4G 2 5 110 SMA J Bendable glue stick omnidirectional antenna TX2400 JK 20 Glue stick antenna 2 4G 3 0 200 SMA J Bendable glue stick omnidirectional antenna...

Page 13: ...tronic Technology Co Ltd 12 Chapter11 Bulk packaging Revision history Version Date Description Issued by 1 0 2017 11 15 initial version huaa 1 1 2018 5 22 Content increase huaa 1 2 2018 9 13 Manual split huaa 1 3 2019 1 26 Content increase Ray 1 4 2019 11 06 Fix mistakes Ren 1 5 2019 11 18 Fix mistakes Ren ...

Page 14: ... Ltd 13 About us Technical support support cdebyte com Documents and RF Setting download link www ebyte com Thank you for using Ebyte products Please contact us with any questions or suggestions info cdebyte com Official hotline 028 61399028 Web www ebyte com Address B5 Mould Park 199 Xiqu Ave High tech District Sichuan China ...

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