Ebyte E01C-ML01SP2, User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual
Copyright ©2012–2020
，
Chengdu Ebyte Electronic Technology Co., Ltd
9
6.3 BER(Bit Error Rate) is high

There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency
and channel to avoid interference;

The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line
should not be too long;

Unsatisfactory power supply may also cause garbled codes. Ensure the reliability of the power supply;

Poor or too long extension cords and feeders will also cause high bit error rates.
Chapter7. Soldering guidance
7.1 Reflow soldering temperature
Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp. 100℃ 150℃
Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquid phase temp. 183℃ 217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid
phase line
60-90 sec 30-90 sec
Peak temperature
（
Tp
）
Peak temp. 220-235℃ 230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average ramp-down
rate
6℃/second max 6℃/second max
Time 25℃ to peak temperature
Time to peak
temperature for 25℃
6 minutes max 8 minutes max