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© e2v technologies (uk) limited 2014 

Document subject to disclaimer on page 1 

A1A-100026 Version 9, page 7 

 

 

ELECTRICAL INTERFACE 

CONNECTIONS, TYPICAL VOLTAGES AND ABSOLUTE MAXIMUM RATINGS 

PGA PIN 

REF 

DESCRIPTION 

CLOCK AMPLITUDE OR DC LEVEL (V)  

(see Note 8

MAX RATINGS 

with respect to 

V

SS 

(V) 

Min 

Typical  

Max 

A1, A8, C1, 

C8, F2, F7 

SS 

Substrate 

See Note 9 

D8 

I

Ø1 

Image clock phase 1 

10 

15 

±20 

E8 

I

Ø2 

Image clock phase 2 

10 

15 

±20 

F8 

I

Ø3 

Image clock phase 3 

10 

15 

±20 

D4 

RØ1 (L) 

Register clock phase 1L 

11 

15 

±20 

E4 

RØ2 (L) 

Register clock phase 2L 

11 

15 

±20 

D5 

RØ1 (R) 

Register clock phase 1R 

11 

15 

±20 

E5 

RØ2 (R) 

Register clock phase 2R 

11 

15 

±20 

F6 

RØ3 

Register clock phase 3 

11 

15 

±20 

E3 

ØR (L) 

Reset gate L 

12 

 15 

±20 

E6 

ØR (R) 

Reset gate R 

12 

15 

±20 

E2 

ØSW (L) 

Summing well gate L 

11 

15 

±20 

E7 

ØSW (R)  Summing well gate R 

11 

15 

±20 

F3 

DG  

Dump gate (see Note 10

-0.5 

15 

±20 

D3 

OG1 (L) 

Output gate 1L 

±20 

D6 

OG1 (R) 

Output gate 1R  

±20 

B2 

DD (L) 

Dump drain 

22 

24 

26 

-0.3 to +30 

B7 

DD (R) 

Dump drain 

22 

24 

26 

-0.3 to +30 

D2 

OG2 (L) 

Output gate 2L  

See Note 11 

±20 

D7 

OG2 (R) 

Output gate 2R  

See Note 11 

±20 

B1 

OD (L) 

Output drain L 

27 

29 

32 

-0.3 to +35 

B8 

OD (R) 

Output drain R 

27 

29 

32 

-0.3 to +35 

A2 

OS (L) 

Output source L 

See Note 12 

-0.3 to +25 

A7 

OS (R) 

Output source R 

See Note 12 

-0.3 to +25 

C2 

RD (L) 

Reset drain L 

15 

17 

19 

-0.3 to +25 

C7 

RD (R) 

Reset drain R 

15 

17 

19 

-0.3 to +25 

Connections for optional U309 JFET (see note 13) 

A3 

RL (L) 

Load resistor L 

Analogue ground

 

(0V) 

 

A6 

RL (R) 

Load resistor R 

Analogue ground(0V) 

 

B3 

OP (L) 

JFET source L 

 

 

B6 

OP (R) 

JFET source R 

 

 

C3 

JD ( L) 

JFET drain L 

OD (L)+2V 

 

C6 

JD ( R) 

JFET drain R 

OD (R)+2V 

 

Optional connections (Temperature sensor- see Note 14

D1, F1 

Temp 

Temperature sensor 

Thermistor 

 

E1 

NC 

No Connection 

 

 

 

If all voltages are set to the typical values, operation should be obtained at or close to the specifications, but some adjustment 
within the minimum-maximum range specified may be required to optimise performance. Refer to the specific device test data 
provided with each device as this gives the optimised values obtained during testing. 

 

Summary of Contents for CCD42-90

Page 1: ...egister is designed to accommodate four image pixels of charge and a summing well is provided capable of holding that from six image pixels The output amplifier has a feature to enable the responsivit...

Page 2: ...grade b Maximum register capacity c Output node capacity under different modes 3 For highest responsivity and lowest nose mode 1 the voltage on OG2 should be 1V higher than that on OG1 For increased c...

Page 3: ...neration rate is 5 e pixel s at 173 K which is also equivalent to 100 e hour at 153 K The temperature dependence is the same as for the mean dark signal see note 6 above Black spots A black spot defec...

Page 4: ...band Deep depletion silicon Astro Midband Deep depletion silicon Astro ER1 response Deep depletion silicon Astro Multi 2 Maximum Pixel Response Non Uniformity PRNU 1 Wavelength nm Minimum QE Minimum Q...

Page 5: ...es of charges as they are transferred from the image section At either end of the register are an additional 50 elements leading to the charge detection amplifiers The last clocked electrodes are sepa...

Page 6: ...st applications the output at OS will be used with external load 1 that can be either a 3 5 mA current source or a 5 10 k resistor RL JD and OP and external load 2 are left unconnected In this mode th...

Page 7: ...1 3 4 20 B2 DD L Dump drain 22 24 26 0 3 to 30 B7 DD R Dump drain 22 24 26 0 3 to 30 D2 OG2 L Output gate 2L See Note 11 20 D7 OG2 R Output gate 2R See Note 11 20 B1 OD L Output drain L 27 29 32 0 3...

Page 8: ...wn For charge dumping DG should be pulsed to within 12 2 V 11 OG1 is typically set to 3 V Then for operation in the high responsivity low noise mode 1 OG2 should be set 1 V higher at typically 4 V For...

Page 9: ...te voltage starts to increase from zero It is also important to ensure that excess currents see Note 12 do not flow in the OS pins Such currents could arise from rapid charging of a signal coupling ca...

Page 10: ...Document subject to disclaimer on page 1 A1A 100026 Version 9 page 10 FRAME READOUT TIMING DIAGRAM DETAIL OF LINE TRANSFER I 1 I 2 I 3 R 1 R 2 R R 3 toi toi toi toi toi tdtr tdrt I 1 I 2 I 3 R 1 R 2 R...

Page 11: ...DETAIL OF OUTPUT CLOCKING tWX tdX Reset feed through Signal output Reset sampling window Signal sampling window Trr R 1 R 2 R R 3 Output tWX tdX Reset feed through Signal output Reset sampling window...

Page 12: ...read out R 1 tdrs tdg2 tdg3 tdg4 tdg1 tdsr Line transfer into register Dump charge into drain Next line read out Line transfer into register DETAIL OF VERTICAL LINE TRANSFER MULTIPLE LINE DUMP 1 2 R...

Page 13: ...clock cycle period 300 see Note 16 see Note 15 ns trr Register pulse rise time 10 to 90 50 0 1Tr 0 3Tr ns tfr Register pulse fall time 10 to 90 trr 0 1Tr 0 3Tr ns tor Register clock pulse overlap 50 0...

Page 14: ...gies uk limited 2014 Document subject to disclaimer on page 1 A1A 100026 Version 9 page 14 PACKAGE DETAIL Package Mass 150 g approx Inactive edge spacing Sides 260 50 m Top 120 50 m Bottom bond connec...

Page 15: ...GY RADIATION Performance parameters will begin to change if the device is subject to ionising radiation Characterisation data is held at e2v technologies with whom it is recommended that contact be ma...

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