DIGITAL-LOGIC AG
MSM800 SEV Manual V1.0A
11
Physical Characteristics:
Dimensions:
Length:
91 mm
Depth:
96 mm
Height:
25 mm
Weight:
170 gr
PCB Thickness:
1.6 mm / 0.0625 inches nominal
PCB Layer:
Multilayer
Operating Environment:
Relative humidity:
5 - 90% non condensing
Vibration:
5 to 2000 Hz, 0.1G
Shock:
1 G
Temperature:
Operating*:
Standard version: - 0°C to +70°C
Extended version: -40°C to +85°C
Storage:
-55°C to +85 °C
* = with passive cooler
EMI / EMC (IEC1131-2 refer MIL 461/462):
ESD Electro Static Discharge:
IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
separate Ground Layer included
15 kV single peak
REF Radiated Electromagnetic Field:
IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.
not tested
EFT Electric Fast Transient (Burst):
IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 ohms, Ts=5ns
Grade 2: 1KV Supply, 500 I/O, 5Khz
SIR Surge Immunity Requirements:
IEC 801-5, IEEE587, VDE 0843 Part 5
Supply:
2 kV, 6 pulse/minute
I/O:
500 V, 2 pulse/minute
FD, CRT:
none
High-frequency Radiation:
EN55022
Compatibility:
MSM800SEV:
Mechanically compatible to our MSMx86 Boards and to all other
PC/104 boards
Any information is subject to change without notice.
2.5
Ordering codes examples
Will follow in a later version of this manual
Summary of Contents for MICROSPACE MSM800SEV
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