Table 24. Particulate contamination specifications (continued)
Particulate contamination
Specifications
NOTE:
Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles
Corrosive dust
●
Air must be free of corrosive dust.
●
Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE:
This condition applies to data center and non-data
center environments.
Table 25. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper Coupon Corrosion rate
<300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal air restrictions
ASHRAE A2 environment
●
CPU TDP > 280 W are not supported.
●
PCIe card TDP > 25 W is not supported.
●
Nvidia A100 80 GB GPU (Max TDP with 500 W) is not supported within ASHRAE A2. Maximum Ambient temperature
supported is 28°C.
Technical specifications
17
