Dell EMC PowerEdge XE8545, Technical Specifications

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Table 21. Thermal restriction matrix (continued)
TDP (W) Heat sink type Fan Type 2 x 2.5" SAS + 8 x 2.5" NVMe
AMD Milan 24C
180W 2.55-2.65
GHz 128 MB
Table 22. GPU/FPGA thermal restriction matrix
TDP (W) Heat sink type Fan Type ASHRAE A2
(Max 35° C)
Ambient Limit
(Max 30° C)
Ambient Limit
(Max 25° C)
Ambient Limit
(Max 20° C)
Nvidia 500 W
A100 80 GB
GPU
2.5U GPU Heat
sink
Very High
Performance
Fan
Not supported
Not supported
(Max ambient
support limit =
28° C)
Supported Supported
Nvidia 400 W
A100 40 GB
GPU
Supported Supported Supported Supported
NOTE: When the 80 GB GPUs are installed, the iDRAC sets the thermal warning threshold to 28° C instead of the normal
38° C.
NOTE: If System Board Inlet Temp reaches 28° C - 32° C, a warning message is logged. It is possible the GPUs may lower
power consumption to avoid thermal damage. This results in lower GPU performance.
Table 23. Processor and heat sink matrix
Heat sink Processor TDP
2U HPR (Silver) HSK Supports all TDP
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from
particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and
results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions
is the responsibility of the customer.
Table 24. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
NOTE: Air filtering can also be accomplished by filtering
room air with MERV8 filter per ANSI/ASHRAE Standard
127
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
16 Technical specifications