Table 70. Particulate contamination specifications (continued)
Particulate contamination
Specifications
NOTE:
This condition applies to data center and non-
data center environments.
Table 71. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper Coupon Corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 72. Thermal restriction matrix for processor and fans
Features, processor type
and specifications
Configuration type, and ambient temperature support
Storage configuration
2 x 2.5-inch drives
4 x 2.5-inch drives
6 x SSDs (EDSFF E1.L)
Fan type
:
Very High Performance fan (VHP fan)
TDP (W)
Ambient = 35°C
Ambient = 35°C
150
Yes (VHP fan)
Yes (VHP fan)
Table 73. Thermal restriction matrix for GPGPU
Riser configurations
Configuration type and ambient temperature support
2 x 2.5-inch drives
4 x 2.5-inch drives
6 x SSDs (EDSFF E1.L)
Fan type
:
Very High Performance fan (VHP fan)
Ambient = 30°C
1A (Slot 1 Riser)
VHP fan
VHP fan
2C (Slot 1 Riser_PERC)
VHP fan
VHP fan
3A (Slot 1 Riser)
VHP fan
VHP fan
All (Slot 4 Riser)
VHP fan
VHP fan
Table 74. Thermal limitations of supported processors
CPU
TDP
HSK
type
Fan
type
Config 1A
Config 2C
Config 3A
ASHAR
E A4
ASHARE
A3
ASHARE
A2
ASHARE
A4
ASHARE
A3
ASHAR
E A2
ASHARE
A4
ASHARE
A3
ASHARE
A2
6525
N, 24
Core,
150 W
High
perform
ance
Very
high
perform
ance
Not supported
Max 35°C
Not supported
Max
35°C
Not supported
Max
35°C
6244,
8
Core,
150 W
162
Technical specifications
