DACE GIGA-S, Instruction Manual

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I
NSTRUCTION
M
ANUAL
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 - 520 - 882 - 6598 Fax +1 - 520 - 882 - 6599 email: pace@metallographic.com Web: https://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
GIGA - S Vibratory Polisher
17
7.2 SiC Polishing Pads
SEM Photograph Polishing Pad Abrasive Application Macro Image
CERMESH ™ Metal Mesh Pad is a wire - mesh
surface useful for coarse and intermediate
lapping/polishing. The texture of this wire allows
for the abrasive to become semi - fixed, thus
offering the advantage of increased stock
removal while minimizing damage.
POLYPAD ™ Polishing Pad is a very tightly
woven and rugged polishing pad for intermediate
polishing which provides good removal and
flatness.
TEXPAN ™ Polishing Pad is commonly used as
an intermediate polishing pad for metals and
ceramics. It is low - napped for superior edge
retention.
BLACK CHEM ™ 2 Polishing Pad is a
porometric polymer pad that has a consistency
similar to a porous rubber type of pad. It has a
low nap and is widely used for chemical -
mechanical polishing (CMP).
DACRON® 2 Polishing Pad is a low - napped
polishing pad for polishing primarily with 1 – 9
micron diamond abrasives. It is also a very
effective pad for coarser alumina abrasives.
NYPAD ™ Polishing Pad is a low - napped silk
polishing pad for intermediate polishing primarily
with mid - sized intermediate diamond abrasives.