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CY7C1410AV18, CY7C1425AV18
CY7C1412AV18, CY7C1414AV18

Document #: 38-05615 Rev. *E

Page 9 of 29

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and V

SS 

to allow the SRAM to adjust its output

driver impedance. The value of RQ must be 5x the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175

Ω

 and 350

Ω

with V

DDQ

= 1.5V.  The

output impedance is adjusted every 1024 cycles upon power up
to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the QDR-II to simplify data capture
on high-speed systems. Two echo clocks are generated by the
QDR-II. CQ is referenced with respect to C and CQ is referenced
with respect to C. These are free-running clocks and are

synchronized to the output clock (C/C) of the QDR-II. In single
clock mode, CQ is generated with respect to K and CQ is
generated with respect to K. The timing for the echo clocks is
shown in the 

Switching Characteristics

 on page 23.

DLL

These chips use a Delay Lock Loop (DLL) that is designed to
function between 120 MHz and the specified maximum clock
frequency. During power up, when the DOFF is tied HIGH, the
DLL is locked after 1024 cycles of stable clock. The DLL can also
be reset by slowing or stopping the input clock K and K for a
minimum of 30 ns. However, it is not necessary to reset the DLL
to lock to the desired frequency. The DLL automatically locks
1024 clock cycles after a stable clock is presented. The DLL may
be disabled by applying ground to the DOFF pin. For information
refer to the application note 

AN5062, DLL Considerations in

QDRII/DDRII/QDRII+/DDRII+

.

Application Example

Figure 1

 shows two QDR-II used in an application.

Figure 1.  Application Example

R = 250

ohms

Vt

R

R = 250

ohms

Vt

Vt

R

Vt = Vddq/2

R = 50

ohms

R

C C#

D
A

SRAM #2

R
P
S
#

W

P
S
#

B

W

S
#

ZQ

CQ/CQ#

Q

K#

C C#

D
A

K

SRAM #1

R
P
S
#

W

P
S
#

B

W

S
#

ZQ

CQ/CQ#

Q

K#

BUS

MASTER

(CPU

or

ASIC)

DATA IN

DATA OUT

Address

RPS#

WPS#
BWS#

Source K

Source K#

Delayed K

Delayed K#

CLKIN/CLKIN#

K

[+] Feedback 

Summary of Contents for CY7C1410AV18

Page 1: ...two separate ports the read port and the write port to access the memory array The read port has data outputs to support read operations and the write port has data inputs to support write operations...

Page 2: ...d Data Reg RPS WPS Control Logic Address Register Reg Reg Reg 8 21 16 8 NWS 1 0 VREF Write Add Decode Write Reg 8 A 20 0 21 CQ CQ DOFF Q 7 0 8 8 Write Reg C C 2M x 8 Array 8 2M x 9 Array CLK A 20 0 Ge...

Page 3: ...RPS WPS Control Logic Address Register Reg Reg Reg 18 20 36 18 BWS 1 0 VREF Write Add Decode Write Reg 18 A 19 0 20 CQ CQ DOFF Q 17 0 18 18 Write Reg C C 1M x 18 Array 18 512K x 36 Array CLK A 18 0 Ge...

Page 4: ...DQ VSS VSS VSS VDDQ NC NC Q0 M NC NC NC VSS VSS VSS VSS VSS NC NC D0 N NC D7 NC VSS A A A VSS NC NC NC P NC NC Q7 A A C A A NC NC NC R TDO TCK A A A C A A A TMS TDI CY7C1425AV18 4M x 9 1 2 3 4 5 6 7 8...

Page 5: ...NC D0 Q0 R TDO TCK A A A C A A A TMS TDI CY7C1414AV18 1M x 36 1 2 3 4 5 6 7 8 9 10 11 A CQ NC 288M NC 72M WPS BWS2 K BWS1 RPS A NC 144M CQ B Q27 Q18 D18 A BWS3 K BWS0 A D17 Q17 Q8 C D27 Q28 D19 VSS A...

Page 6: ...for CY7C1410AV18 4M x 9 2 arrays each of 2M x 9 for CY7C1425AV18 2M x 18 2 arrays each of 1M x 18 for CY7C1412AV18 and 1M x 36 2 arrays each of 512K x 36 for CY7C1414AV18 Therefore only 21 address in...

Page 7: ...Alternatively this pin can be connected directly to VDDQ which enables the minimum impedance mode This pin cannot be connected directly to GND or left unconnected DOFF Input DLL Turn Off Active LOW Co...

Page 8: ...between devices without the insertion of wait states in a depth expanded memory Write Operations Write operations are initiated by asserting WPS active at the rising edge of the positive input clock K...

Page 9: ...to K and CQ is generated with respect to K The timing for the echo clocks is shown in the Switching Characteristics on page 23 DLL These chips use a Delay Lock Loop DLL that is designed to function b...

Page 10: ...0 is written into the device D 17 9 remains unaltered H L L H During the data portion of a write sequence CY7C1410AV18 only the upper nibble D 7 4 is written into the device D 3 0 remains unaltered CY...

Page 11: ...into the device D 35 9 remains unaltered L H H H L H During the Data portion of a write sequence only the lower byte D 8 0 is written into the device D 35 9 remains unaltered H L H H L H During the Da...

Page 12: ...edge of TCK Instruction Register Three bit instructions can be serially loaded into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Con...

Page 13: ...scan register After the data is captured it is possible to shift out the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRELOAD pla...

Page 14: ...oller follows 9 TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR 1 0 1 1 0 1 0 1 0 0 0 1 1 1 0 1 0 1 0 0 0 1 0 1 1 0 1 0 0 1 1 0 SELECT IR SCAN...

Page 15: ...GH Voltage 0 65VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register Identification Register 0 1 2 108 0 1 2 Instr...

Page 16: ...IH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Conditions Figu...

Page 17: ...ruction Codes Instruction Code Description EXTEST 000 Captures the input and output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO T...

Page 18: ...8P 35 10E 63 2A 91 3L 8 9R 36 10D 64 1A 92 1M 9 11P 37 9E 65 2B 93 1L 10 10P 38 10C 66 3B 94 3N 11 10N 39 11D 67 1C 95 3M 12 9P 40 9C 68 1B 96 1N 13 10M 41 9D 69 3D 97 2M 14 11N 42 11B 70 3C 98 3P 15...

Page 19: ...K K for 1024 cycles to lock the DLL DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which is specified as tKC Var The DLL functions at frequencies dow...

Page 20: ...HIGH Voltage Note 16 VDDQ 2 0 12 VDDQ 2 0 12 V VOL Output LOW Voltage Note 17 VDDQ 2 0 12 VDDQ 2 0 12 V VOH LOW Output HIGH Voltage IOH 0 1 mA Nominal Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Vol...

Page 21: ...20 x36 475 200MHz x8 350 mA x9 350 x18 370 x36 420 167MHz x8 330 mA x9 330 x18 345 x36 390 AC Electrical Characteristics Over the Operating Range 11 Parameter Description Test Conditions Min Typ Max U...

Page 22: ...tion to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 17 2 C W JC Thermal Resistance Junction to Case 3 2 C W Figure...

Page 23: ...gle Clock Mode to Data Valid 0 45 0 45 0 50 ns tDOH tCHQX Data Output Hold after Output C C Clock Rise Active to Active 0 45 0 45 0 50 ns tCCQO tCHCQV C C Clock Rise to Echo Clock Valid 0 45 0 45 0 50...

Page 24: ...D50 D51 D61 D31 D11 D10 D60 Q C C DON T CARE UNDEFINED t CQ CQ tKHCH tCO tKHCH tCLZ CHZ tKH tKL Q00 Q01 Q20 tKHKH tCYC Q21 Q40 Q41 tCQD tDOH tCCQO tCQOH tCCQO tCQOH tCQDOH Notes 26 Q00 refers to outp...

Page 25: ...Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1425AV18 250BZI CY7C1412AV18 250BZI CY7C1414AV18 250BZI CY7C1410AV18 250BZXI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Pb...

Page 26: ...8 167BZXC CY7C1410AV18 167BZI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1425AV18 167BZI CY7C1412AV18 167BZI CY7C1414AV18 167BZI CY7C1410AV18 167BZXI 51 85195 165 Bal...

Page 27: ...0 25 M C A B 0 05 M C B A 0 15 4X 0 35 0 06 1 40 MAX SEATING PLANE 0 53 0 05 0 25 C 0 15 C PIN 1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 5 6 7 8 9 10 10 00 14 00 B C D E F G H J K L M N 11 11 10 9 8 6 7 5 4...

Page 28: ...Power up sequence and Wave form on page 19 Added foot notes 13 14 15 on page 19 Replaced Three state with Tri state Changed the description of IX from Input Load Current to Input Leakage Current on pa...

Page 29: ...presentation of this Source Code except as specified above is prohibited without the express written permission of Cypress Disclaimer CYPRESS MAKES NO WARRANTY OF ANY KIND EXPRESS OR IMPLIED WITH REGA...

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