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CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Document Number: 38-05545 Rev. *E

Page 7 of 30

Functional Overview

All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. 
The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F
supports secondary cache in systems using either a linear or
interleaved burst sequence. The interleaved burst order
supports Pentium

®

 and i486

 processors. The linear burst

sequence is suited for processors that use a linear burst
sequence. The burst order is user selectable, and is
determined by sampling the MODE input. Accesses can be
initiated with either the processor address strobe (ADSP) or
the controller address strobe (ADSC). Address advancement
through the burst sequence is controlled by the ADV input. A
two-bit on-chip wraparound burst counter captures the first
address in a burst sequence and automatically increments the
address for the rest of the burst access.
Byte write operations are qualified with the byte write enable
(BWE) and byte write select (BW

X

) inputs. A global write

enable (GW) overrides all byte write inputs and writes data to
all four bytes. All writes are simplified with on-chip
synchronous self timed write circuitry.
Synchronous chip selects CE

1

, CE

2

, CE

[2]

 

and an

asynchronous output enable (OE) provide for easy bank
selection and output tri-state control. ADSP is ignored if CE

1

is HIGH.

Single Read Accesses

This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2)
chip selects are all asserted active, and (3) the write signals
(GW, BWE) are all deasserted HIGH. ADSP is ignored if CE

1

is HIGH. The address presented to the address inputs is
stored into the address advancement logic and the address
register while being presented to the memory core. The
corresponding data is allowed to propagate to the input of the
output registers. At the rising edge of the next clock the data
is allowed to propagate through the output register and onto
the data bus within t

CO

 if OE is active LOW. The only exception

occurs when the SRAM is emerging from a deselected state
to a selected state, its outputs are always tri-stated during the
first cycle of the access. After the first cycle of the access, the
outputs are controlled by the OE signal. Consecutive single
read cycles are supported. 
The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F is a
double cycle deselect part. Once the SRAM is deselected at
clock rise by the chip select and either ADSP or ADSC signals,
its output will tri-state immediately after the next clock rise.

Single Write Accesses Initiated by ADSP

This access is initiated when both of the following conditions
are satisfied at clock rise: (1) ADSP is asserted LOW, and (2)
chip select is asserted active. The address presented is
loaded into the address register and the address
advancement logic while being delivered to the memory core.

V

SS

Ground

Ground for the core of the device

V

SSQ

IO Ground

Ground for the IO circuitry

V

DDQ

IO Power Supply

Power supply for the IO circuitry

MODE

Input-

Static

Selects burst order

. When tied to GND selects linear burst sequence. When tied

to V

DD

 or left floating selects interleaved burst sequence. This is a strap pin and

must remain static during device operation. Mode pin has an internal pull up.

TDO

JTAG serial output

Synchronous

Serial data-out to the JTAG circuit

. Delivers data on the negative edge of TCK. If

the JTAG feature is not used, this pin must be disconnected. This pin is not available
on TQFP packages.

TDI

JTAG serial 

input

Synchronous

Serial data-in to the JTAG circuit

. Sampled on the rising edge of TCK. If the JTAG

feature is not used, this pin can be disconnected or connected to V

DD

. This pin is

not available on TQFP packages.

TMS

JTAG serial 

input

Synchronous

Serial data-in to the JTAG circuit

. Sampled on the rising edge of TCK. If the JTAG

feature is not used, this pin can be disconnected or connected to V

DD

. This pin is

not available on TQFP packages.

TCK

JTAG-

Clock

Clock input to the JTAG circuitry

. If the JTAG feature is not used, this pin must

be connected to V

SS

. This pin is not available on TQFP packages.

NC

No Connects

. Not internally connected to the die

NC/(36M, 72M, 
144M, 288M, 
576M, 1G)

These pins are not connected.

 They will be used for expansion to the 36M, 72M,

144M, 288M, 576M, and 1G densities.

Pin Definitions

 (continued)

Name

IO

Description

[+] Feedback 

Summary of Contents for CY7C1386D

Page 1: ...ning chip enable CE1 depth expansion chip enables CE2 and CE3 2 burst control inputs ADSC ADSP and ADV write enables BWX and BWE and global write GW Asynchronous inputs include the output enable OE an...

Page 2: ...BLE OUTPUT REGISTERS SENSE AMPS MEMORY ARRAY OUTPUT BUFFERS DQA DQP A BYTE WRITE DRIVER DQB DQP B BYTE WRITE DRIVER DQc DQP C BYTE WRITE DRIVER DQD DQP D BYTE WRITE DRIVER INPUT REGISTERS A0 A1 A A 1...

Page 3: ...67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1386D 512K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD A A A A A A A A A N...

Page 4: ...DQD DQD DQD DQD ADSC NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M NC DQ...

Page 5: ...DQB DQB DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1387D 1M x 18 A0 A VSS 2...

Page 6: ...ocument for BGA CE3 is sampled only when a new external address is loaded OE Input Asynchronous Output enable asynchronous input active LOW Controls the direction of the IO pins When LOW the IO pins b...

Page 7: ...ion occurs when the SRAM is emerging from a deselected state to a selected state its outputs are always tri stated during the first cycle of the access After the first cycle of the access the outputs...

Page 8: ...synchronous self timed write mechanism has been provided to simplify the write operations The CY7C1386D CY7C1387D CY7C1386F CY7C1387F is a common IO device the output enable OE must be deasserted HIGH...

Page 9: ...ite Cycle Continue Burst Next H X X L X H L L X L H D Read Cycle Suspend Burst Current X X X L H H H H L L H Q Read Cycle Suspend Burst Current X X X L H H H H H L H Tri State Read Cycle Suspend Burst...

Page 10: ...nd DQPD H L L H H H Write Bytes D A H L L H H L Write Bytes D B H L L H L H Write Bytes D B A H L L H L L Write Bytes D C H L L L H H Write Bytes D C A H L L L H L Write Bytes D C B H L L L L H Write...

Page 11: ...nconnected if the TAP is unused in an application TDI is connected to the most signif icant bit MSB of any register See TAP Controller Block Diagram Test Data Out TDO The TDO output ball is used to se...

Page 12: ...ls and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift DR state The IDCODE instruction is loaded into the instruction register upon power up or whenever the...

Page 13: ...hese instructions are not implemented but are reserved for future use Do not use these instructions TAP Timing TAP AC Switching Characteristics Over the Operating Range 10 11 Parameter Description Min...

Page 14: ...quivalent TDO 1 5V 20pF Z 50 O 50 TDO 1 25V 20pF Z 50 O 50 TAP DC Electrical Characteristics And Operating Conditions 0 C TA 70 C VDD 3 3V 0 165V unless otherwise noted 12 Parameter Description Test C...

Page 15: ...5 85 Boundary Scan Order 165 ball FBGA package 89 89 Identification Codes Instruction Code Description EXTEST 000 Captures IO ring contents Places the boundary scan register between TDI and TDO Forces...

Page 16: ...K1 6 L5 28 E6 50 B3 72 L2 7 R6 29 D6 51 A3 73 N2 8 U6 30 C7 52 C2 74 P2 9 R7 31 B7 53 A2 75 R3 10 T7 32 C6 54 B1 76 T1 11 P6 33 A6 55 C1 77 R1 12 N7 34 C5 56 D2 78 T2 13 M6 35 B5 57 E1 79 L3 14 L7 36...

Page 17: ...67 H3 8 P9 38 B9 68 J1 9 P10 39 C10 69 K1 10 R10 40 A8 70 L1 11 R11 41 B8 71 M1 12 H11 42 A7 72 J2 13 N11 43 B7 73 K2 14 M11 44 B6 74 L2 15 L11 45 A6 75 M2 16 K11 46 B5 76 N1 17 J11 47 A5 77 N2 18 M1...

Page 18: ...r 3 3V IO 2 0 VDD 0 3V V for 2 5V IO 1 7 VDD 0 3V V VIL Input LOW Voltage 17 for 3 3V IO 0 3 0 8 V for 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of...

Page 19: ...Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 28 66 23 8 20 7 C W JC Thermal Resistance Junction to Cas...

Page 20: ...5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 4 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 3 0 4 0 5 ns tADVH ADV Hold After CLK Rise 0 3 0 4 0 5 ns tWEH GW BWE BWX Hold After CLK Rise 0 3 0...

Page 21: ...h Z tDOH tCO ADV tOEHZ tCO SingleREAD BURSTREAD tOEV tOELZ tCHZ Burstwrapsaround toitsinitialstate tADVH tADVS tWEH tWES tADH tADS Q A2 Q A2 1 Q A2 2 Q A1 Q A2 Q A2 1 Q A3 Q A2 3 A2 A3 Deselect cycle...

Page 22: ...ST READ BURST WRITE D A2 D A2 1 D A3 D A3 1 D A2 3 A2 A3 Extended BURST WRITE Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS tWEH tWES t DH t DS GW tWEH tWES Byte write signals are ignored for rs...

Page 23: ...SC CE tAH tAS A2 tCEH tCES Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D A5 D A6 Data In D BURST READ Back to Back READs High Z Q A2 Q A1 Q A4 tWEH tWES Q A4 3 tOEHZ tDH tDS tOELZ tCLZ tCO Back t...

Page 24: ...nued t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS except ZZ DON T CARE I DDZZ t ZZI tRZZI Outputs Q High Z DESELECT or READ Only Notes 30 Device must be deselected when entering ZZ sleep mode See cycle des...

Page 25: ...119 ball Ball Grid Array 14 x 22 x 2 4 mm Pb Free CY7C1387F 167BGXI CY7C1386D 167BZI 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1387D 167BZI CY7C1386D 167BZXI 51 85180 165 ball...

Page 26: ...3 x 15 x 1 4 mm Pb Free CY7C1387D 250BZXC CY7C1386D 250AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Pb Free Industrial CY7C1387D 250AXI CY7C1386F 250BGI 51 85115 119 ball Ball Grid Array...

Page 27: ...PROTRUSION END FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0...

Page 28: ...CY7C1386D CY7C1386F CY7C1387D CY7C1387F Document Number 38 05545 Rev E Page 28 of 30 Figure 2 119 Ball BGA 14 x 22 x 2 4 mm 51 85115 Package Diagrams continued 51 85115 B Feedback...

Page 29: ...is a trademark of Intel Corporation PowerPC is a trademark of IBM Corporation All product and company names mentioned in this document are the trademarks of their respective holders Figure 3 165 Ball...

Page 30: ...nd JC for BGA Package from 45 and 7 C W to 23 8 and 6 2 C W respectively Changed JA and JC for FBGA Package from 46 and 3 C W to 20 7 and 4 0 C W respectively Modified VOL VOH test conditions Removed...

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