Cypress Semiconductor CY7C1364C, Specification Sheet

Page: 10 / 18

CY7C1364C
Document #: 38-05689 Rev. *E Page 10 of 18
Capacitance
[11]
Parameter Description Test Conditions
100 TQFP
Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V
V
DDQ
= 2.5V
5 pF
C
CLK
Clock Input Capacitance 5 pF
C
I/O
Input/Output Capacitance 5 pF
Thermal Resistance
[11]
Parameter Description Test Conditions 100 TQFP Package Unit
Θ
JA
Thermal Resistance
(Junction to Ambient) Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51 29.41
°
C/W
Θ
JC
Thermal Resistance
(Junction to Case) 6.13
°
C/W
AC Test Loads and Waveforms
Note:
11. Tested initially and after any design or process change that may affect these parameters
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
OUTPUT
R = 1667
Ω
R =1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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