Cypress Semiconductor CY7C1339G Specification Sheet Download Page 5

CY7C1339G

Document #: 38-05520 Rev. *F

Page 5 of 18

signal. Consecutive single Read cycles are supported. Once
the SRAM is deselected at clock rise by the chip select and
either ADSP or ADSC signals, its output will tri-state immedi-
ately.

Single Write Accesses Initiated by ADSP

This access is initiated when both of the following conditions
are satisfied at clock rise: (1) ADSP is asserted LOW, and
(2) CE

1

, CE

2

, CE

3

 are all asserted active. The address

presented to A is loaded into the address register and the
address advancement logic while being delivered to the
memory array. The Write signals (GW, BWE, and BW

[A:D]

) and

ADV inputs are ignored during this first cycle. 

ADSP-triggered Write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the corre-
sponding address location in the memory array. If GW is HIGH,
then the Write operation is controlled by BWE and BW

[A:D]

signals. The CY7C1339G provides Byte Write capability that
is described in the Write Cycle Descriptions table. Asserting
the Byte Write Enable input (BWE) with the selected Byte
Write (BW

[A:D]

) input, will selectively write to only the desired

bytes. Bytes not selected during a Byte Write operation will
remain unaltered. A synchronous self-timed Write mechanism
has been provided to simplify the Write operations. 

Because the CY7C1339G is a common I/O device, the Output
Enable (OE) must be deserted HIGH before presenting data
to the DQs inputs. Doing so will tri-state the output drivers. As
a safety precaution, DQs are automatically tri-stated whenever
a Write cycle is detected, regardless of the state of OE.

Single Write Accesses Initiated by ADSC

ADSC Write accesses are initiated when the following condi-
tions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is
deserted HIGH, (3) CE

1

, CE

2

, CE

3

 are all asserted active, and

(4) the appropriate combination of the Write inputs (GW, BWE,
and BW

[A:D]

) are asserted active to conduct a Write to the

desired byte(s). ADSC-triggered Write accesses require a
single clock cycle to complete. The address presented to A is
loaded into the address register and the address
advancement logic while being delivered to the memory array.
The ADV input is ignored during this cycle. If a global Write is
conducted, the data presented to the DQs is written into the
corresponding address location in the memory core. If a Byte
Write is conducted, only the selected bytes are written. Bytes
not selected during a Byte Write operation will remain
unaltered. A synchronous self-timed Write mechanism has
been provided to simplify the Write operations. 

Because the CY7C1339G is a common I/O device, the Output
Enable (OE) must be deserted HIGH before presenting data

to the DQs inputs. Doing so will tri-state the output drivers. As
a safety precaution, DQs are automatically tri-stated whenever
a Write cycle is detected, regardless of the state of OE.

Burst Sequences

The CY7C1339G provides a two-bit wraparound counter, fed
by A1, A0, that implements either an interleaved or linear burst
sequence. The interleaved burst sequence is designed specif-
ically to support Intel Pentium applications. The linear burst
sequence is designed to support processors that follow a
linear burst sequence. The burst sequence is user selectable
through the MODE input.

Asserting ADV LOW at clock rise will automatically increment
the burst counter to the next address in the burst sequence.
Both Read and Write burst operations are supported.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE

1

, CE

2

, CE

3

, ADSP, and ADSC must

remain inactive for the duration of t

ZZREC

 after the ZZ input

returns LOW.

Interleaved Burst Address Table 
(MODE = Floating or V

DD

)

First

Address

A1, A0

Second

Address

A1, A0

Third

Address

A1, A0

Fourth

Address

A1, A0

00

01

10

11

01

00

11

10

10

11

00

01

11

10

01

00

Linear Burst Address Table (MODE = GND)

First 

Address

A1, A0

Second

Address

A1, A0

Third 

Address

A1, A0

Fourth

Address

A1, A0

00

01

10

11

01

10

11

00

10

11

00

01

11

00

01

10

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min.

Max.

Unit

I

DDZZ

Snooze mode standby current

ZZ > V

DD

 

– 0.2V

40

mA

t

ZZS

Device operation to ZZ

ZZ > V

DD

 – 0.2V

2t

CYC

ns

t

ZZREC

ZZ recovery time

ZZ < 0.2V

2t

CYC

ns

t

ZZI

ZZ active to snooze current

This parameter is sampled

2t

CYC

ns

t

RZZI

ZZ Inactive to exit snooze current

This parameter is sampled

0

ns

[+] Feedback 

Summary of Contents for CY7C1339G

Page 1: ...Write GW Asynchronous inputs include the Output Enable OE and the ZZ pin Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor ADSP or Address Strobe...

Page 2: ...A DQA DQA DQA VSSQ VDDQ DQA DQA NC NC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC A A CE 1 CE 2 BW D BW C BW B BW A CE 3 V...

Page 3: ...sampled only when a new external address is loaded CE2 Input Synchronous Chip Enable 2 Input active HIGH Sampled on the rising edge of CLK Used in conjunction with CE1 and CE3 to select deselect the d...

Page 4: ...tate to a selected state its outputs are always tri stated during the first cycle of the access After the first cycle of the access the outputs are controlled by the OE ADV Input Synchronous Advance I...

Page 5: ...s conducted the data presented to the DQs is written into the corresponding address location in the memory core If a Byte Write is conducted only the selected bytes are written Bytes not selected duri...

Page 6: ...X X X L H H H H L L H Q READ Cycle Suspend Burst Current X X X L H H H H H L H Tri State READ Cycle Suspend Burst Current H X X L X H H H L L H Q READ Cycle Suspend Burst Current H X X L X H H H H L H...

Page 7: ...rite Bytes C B H L H L L H Write Bytes C B A H L H L L L Write Byte D DQD H L L H H H Write Bytes D A H L L H H L Write Bytes D B H L L H L H Write Bytes D B A H L L H L L Write Bytes D C H L L L H H...

Page 8: ...V for 2 5V I O IOL 1 0 mA 0 4 V VIH Input HIGH Voltage 9 for 3 3V I O 2 0 VDD 0 3V V for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 9 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage...

Page 9: ...Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 30 32 34 1 C W JC Thermal Resistance Junction to Case 6 85 14 0 C W AC T...

Page 10: ...1 5 1 5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tWEH GW BWE BWX Hold Af...

Page 11: ...CE3 is HIGH tCYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE tAH tAS A1 tCEH tCES GW BWE BW A D Data Out Q High Z tCLZ tDOH tCO ADV tOEHZ tCO Single READ BURST READ tOEV tOELZ tCHZ ADV suspends...

Page 12: ...ADS ADDRESS tCH OE ADSC CE tAH tAS A1 tCEH tCES BWE BW A D Data Out Q High Z ADV BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Data In D Extended BURST WRITE D A2 2 Si...

Page 13: ...ed by ADSP or ADSC 21 GW is HIGH Switching Waveforms continued tCYC tCL CLK ADSP tADH tADS ADDRESS tCH OE ADSC CE tAH tAS A2 tCEH tCES BWE BW A D Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D A5...

Page 14: ...entering ZZ mode See Cycle Descriptions table for all possible signal conditions to deselect the device 23 DQs are in high Z when exiting ZZ sleep mode Switching Waveforms continued t ZZ I SUPPLY CLK...

Page 15: ...39G 166BGXC 119 ball Ball Grid Array 14 x 22 x 2 4 mm Lead Free CY7C1339G 166AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free Industrial CY7C1339G 166BGI 51 85115 119 ball Ball Grid...

Page 16: ...IONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0 7 8X STAND OFF...

Page 17: ...al components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress products in life support systems ap...

Page 18: ...ormation by shading and unshading MPNs as per availability C 351194 See ECN PCI Updated Ordering Information Table D 366728 See ECN PCI Added VDD VDDQ test conditions in DC Table Modified test conditi...

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