Cypress Semiconductor CY7C1339G Specification Sheet Download Page 18

CY7C1339G

Document #: 38-05520 Rev. *F

Page 18 of 18

Document History Page

Document Title: CY7C1339G 4-Mbit (128K x 32) Pipelined Sync SRAM
Document Number: 38-05520

REV.

ECN NO. Issue Date

Orig. of 

Change

Description of Change

**

224368

See ECN

RKF

New data sheet

*A

288909

See ECN

VBL

In Ordering Info section, Changed TQFP to PB-free TQFP
Added PB-free BG package

*B

332895

See ECN

SYT

Modified Address Expansion balls in the pinouts for 100 TQFP and 119 BGA 
Package as per JEDEC standards and updated the Pin Definitions accordingly
Modified V

OL, 

V

OH 

test conditions

Replaced TBDs for 

Θ

JA

 and 

Θ

JC

 to their respective values on the Thermal Resis-

tance table 
Updated the Ordering Information by shading and unshading MPNs as per 
availability

*C

351194

See ECN

PCI

Updated Ordering Information Table

*D

366728

See ECN

PCI

Added V

DD

/V

DDQ

 test conditions in DC Table

Modified test condition in note# 10 from V

IH

 < V

DD 

to

 

V

IH 

V

DD

*E

420883

See ECN

RXU

Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901 
North First Street” to “198 Champion Court”
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the 
Electrical Characteristics Table
Replaced Package Name column with Package Diagram in the Ordering Infor-
mation table
Replaced Package Diagram of 51-85050 from *A to *B
Added Automotive Range in Operating Range Table
Updated the Ordering Information

*F

480368

See ECN

VKN

Added the Maximum Rating for Supply Voltage on V

DDQ

 Relative to GND.

Updated the Ordering Information table.

[+] Feedback 

Summary of Contents for CY7C1339G

Page 1: ...Write GW Asynchronous inputs include the Output Enable OE and the ZZ pin Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor ADSP or Address Strobe...

Page 2: ...A DQA DQA DQA VSSQ VDDQ DQA DQA NC NC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC A A CE 1 CE 2 BW D BW C BW B BW A CE 3 V...

Page 3: ...sampled only when a new external address is loaded CE2 Input Synchronous Chip Enable 2 Input active HIGH Sampled on the rising edge of CLK Used in conjunction with CE1 and CE3 to select deselect the d...

Page 4: ...tate to a selected state its outputs are always tri stated during the first cycle of the access After the first cycle of the access the outputs are controlled by the OE ADV Input Synchronous Advance I...

Page 5: ...s conducted the data presented to the DQs is written into the corresponding address location in the memory core If a Byte Write is conducted only the selected bytes are written Bytes not selected duri...

Page 6: ...X X X L H H H H L L H Q READ Cycle Suspend Burst Current X X X L H H H H H L H Tri State READ Cycle Suspend Burst Current H X X L X H H H L L H Q READ Cycle Suspend Burst Current H X X L X H H H H L H...

Page 7: ...rite Bytes C B H L H L L H Write Bytes C B A H L H L L L Write Byte D DQD H L L H H H Write Bytes D A H L L H H L Write Bytes D B H L L H L H Write Bytes D B A H L L H L L Write Bytes D C H L L L H H...

Page 8: ...V for 2 5V I O IOL 1 0 mA 0 4 V VIH Input HIGH Voltage 9 for 3 3V I O 2 0 VDD 0 3V V for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 9 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage...

Page 9: ...Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 30 32 34 1 C W JC Thermal Resistance Junction to Case 6 85 14 0 C W AC T...

Page 10: ...1 5 1 5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tWEH GW BWE BWX Hold Af...

Page 11: ...CE3 is HIGH tCYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE tAH tAS A1 tCEH tCES GW BWE BW A D Data Out Q High Z tCLZ tDOH tCO ADV tOEHZ tCO Single READ BURST READ tOEV tOELZ tCHZ ADV suspends...

Page 12: ...ADS ADDRESS tCH OE ADSC CE tAH tAS A1 tCEH tCES BWE BW A D Data Out Q High Z ADV BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Data In D Extended BURST WRITE D A2 2 Si...

Page 13: ...ed by ADSP or ADSC 21 GW is HIGH Switching Waveforms continued tCYC tCL CLK ADSP tADH tADS ADDRESS tCH OE ADSC CE tAH tAS A2 tCEH tCES BWE BW A D Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D A5...

Page 14: ...entering ZZ mode See Cycle Descriptions table for all possible signal conditions to deselect the device 23 DQs are in high Z when exiting ZZ sleep mode Switching Waveforms continued t ZZ I SUPPLY CLK...

Page 15: ...39G 166BGXC 119 ball Ball Grid Array 14 x 22 x 2 4 mm Lead Free CY7C1339G 166AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free Industrial CY7C1339G 166BGI 51 85115 119 ball Ball Grid...

Page 16: ...IONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0 7 8X STAND OFF...

Page 17: ...al components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress products in life support systems ap...

Page 18: ...ormation by shading and unshading MPNs as per availability C 351194 See ECN PCI Updated Ordering Information Table D 366728 See ECN PCI Added VDD VDDQ test conditions in DC Table Modified test conditi...

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