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PRELIMINARY

CY7C1333H

Document #: 001-00209 Rev. **

Page 3 of 12

Pin Definitions

 (100-pin TQFP Package) 

Name

I/O

Description

A

0

, A

1

, A

Input-

Synchronous

Address Inputs used to select one of the 64K address locations

. Sampled at the rising edge 

of the CLK. A

[1:0]

 are fed to the two-bit burst counter.

BW

[A:D]

Input-

Synchronous

Byte Write Inputs, active LOW

. Qualified with WE to conduct Writes to the SRAM. Sampled on 

the rising edge of CLK.

WE

Input-

Synchronous

Write Enable Input, active LOW

. Sampled on the rising edge of CLK if CEN is active LOW. This 

signal must be asserted LOW to initiate a Write sequence.

ADV/LD

Input-

Synchronous

Advance/Load Input

. Used to advance the on-chip address counter or load a new address. When 

HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new 
address can be loaded into the device for an access. After being deselected, ADV/LD should be 
driven LOW in order to load a new address.

CLK

Input-Clock

Clock Input

. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK 

is only recognized if CEN is active LOW.

CE

1

Input-

Synchronous

Chip Enable 1 Input, active LOW

. Sampled on the rising edge of CLK. Used in conjunction with 

CE

2

, and CE

3

 to select/deselect the device.

CE

2

Input-

Synchronous

Chip Enable 2 Input, active HIGH

. Sampled on the rising edge of CLK. Used in conjunction with 

CE

and CE

3

 to select/deselect the device. 

CE

3

Input-

Synchronous

Chip Enable 3 Input, active LOW

. Sampled on the rising edge of CLK. Used in conjunction with 

CE

1

 and

 

CE

to select/deselect the device.

 

OE

Input-

Asynchronous

Output Enable, asynchronous input, active LOW

. Combined with the synchronous logic block 

inside the device to control the direction of the I/O pins. When LOW, the I/O pins are allowed to 
behave as outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins. 
OE is masked during the data portion of a Write sequence, during the first clock when emerging 
from a deselected state, when the device has been deselected. 

CEN

Input-

Synchronous

Clock Enable Input, active LOW

. When asserted LOW the Clock signal is recognized by the 

SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not 
deselect the device, CEN can be used to extend the previous cycle when required.

ZZ

Input-

Asynchronous

ZZ “Sleep” Input

. This active HIGH input places the device in a non-time critical “sleep” condition 

with data integrity preserved. During normal operation, this pin can be connected to V

SS

 or left 

floating.

DQ

s

I/O-

Synchronous

Bidirectional Data I/O Lines

. As inputs, they feed into an on-chip data register that is triggered 

by the rising edge of CLK. As outputs, they deliver the data contained in the memory location 
specified by address during the clock rise of the Read cycle. The direction of the pins is controlled 
by OE and the internal control logic. When OE is asserted LOW, the pins can behave as outputs. 
When HIGH, DQ

are placed in a three-state condition. The outputs are automatically three-stated 

during the data portion of a Write sequence, during the first clock when emerging from a deselected 
state, and when the device is deselected, regardless of the state of OE.

Mode

Input

Strap Pin

Mode Input. Selects the burst order of the device. 

When tied to Gnd selects linear burst sequence. When tied to V

DD

 or left floating selects interleaved 

burst sequence.

V

DD

Power Supply

Power supply inputs to the core of the device

V

DDQ

I/O Power 

Supply

Power supply for the I/O circuitry

V

SS

Ground

Ground for the device

NC

No Connects

. Not Internally connected to the die. 

4M, 9M,18M,36M, 72M, 144M, 256M, 576M and 1G are address expansion pins and are not 
internally connected to the die.

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Summary of Contents for CY7C1333H

Page 1: ...ith data being transferred on every clock cycle This feature dramatically improves the throughput of data through the SRAM especially in systems that require frequent Write Read transitions All synchr...

Page 2: ...B DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA NC NC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS V...

Page 3: ...e allowed to behave as outputs When deasserted HIGH I O pins are three stated and act as input data pins OE is masked during the data portion of a Write sequence during the first clock when emerging f...

Page 4: ...n incremented sufficiently A HIGH input on ADV LD will increment the internal burst counter regardless of the state of chip enable inputs or WE WE is latched at the beginning of a burst cycle Therefor...

Page 5: ...t X X X L H X X L L L H Data Out Q NOP DUMMY READ Begin Burst External L H L L L H X H L L H Three State DUMMY READ Continue Burst Next X X X L H X X H L L H Three State WRITE Cycle Begin Burst Extern...

Page 6: ...12 Truth Table for Read Write 2 3 Function WE BWA BWB BWC BWD Read H X X X X Write No Bytes Written L H H H H Write Byte A DQA L L H H H Write Byte B DQB L H L H H Write Byte C DQC L H H L H Write By...

Page 7: ...Current GND VI VDD Output Disabled 5 5 A IDD VDD Operating Supply Current VDD Max IOUT 0 mA f fMAX 1 tCYC 7 5 ns cycle 133 MHz 225 mA 10 ns cycle 100 MHz 205 mA ISB1 Automatic CE Power down Current T...

Page 8: ...2 0 ns tCENS CEN Set up before CLK Rise 1 5 2 0 ns tDS Data Input Set up before CLK Rise 1 5 2 0 ns tCES Chip Enable Set Up before CLK Rise 1 5 2 0 ns Notes 12 Timing reference level is 1 5V when VDD...

Page 9: ...n CE is HIGH CE1 is HIGH or CE2 is LOW or CE3 is HIGH 20 Order of the Burst sequence is determined by the status of the MODE 0 Linear 1 Interleaved Burst operations are optional Switching Characterist...

Page 10: ...133AXC A101 Lead Free 100 lead Thin Quad Flat Pack 14 x 20 x 1 4 mm Commercial CY7C1333H 133AXI A101 Lead Free 100 lead Thin Quad Flat Pack 14 x 20 x 1 4 mm Industrial 100 CY7C1333H 100AXC A101 Lead F...

Page 11: ...s written agreement with Cypress Furthermore Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be expected to...

Page 12: ...Page 12 of 12 Document History Page Document Title CY7C1333H 2 Mbit 64K x 32 Flow Through SRAM with NoBL Architecture Document Number 001 00209 REV ECN NO Issue Date Orig of Change Description of Chan...

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