SOLDERING & HANDLING
Cree LED / 4400 Silicon Drive / Durham, NC 27703 USA / +1.919.313.5330 /
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree
®
and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp
®
is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4
1
XLamp
®
MH Family LED
INTRODUCTION
This application note applies to XLamp
®
MH Family LEDs, which
have order codes in the following format:
MHxxxx-xxxx-xxxxxxxxxxx
This application note explains how XLamp MH Family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp MH Family LEDs.
TABLE OF CONTENTS
MH Family LEDs .................................................2
Circuit Board Preparation & Layouts ................................................5
Case Temperature (T
) Measurement Point ....................................6
MH Family LEDs ................................7
Moisture Sensitivity ..........................................................................8
Low Temperature Operation .............................................................8
XLamp
MH Family LED Reflow Soldering Characteristics
Chemicals & Conformal Coatings ................................................. 10
Assembly Storage & Handling ....................................................... 11
Tape and Reel ................................................................................. 12
Packaging & Labels ....................................................................... 14