XLAMP
®
MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree
®
and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp
®
is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4
8
After Soldering
After soldering, allow XLamp MH Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the optical surface, could result in damage to the LED.
Cree LED recommends verifying that soldered LEDs are not tilted, a situation called tombstoning. As a general guideline, an LED is tilted
when the part has a low edge touching the PCB surface and a high edge above the PCB surface.
Cree LED recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re‑flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree LED recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is
necessary, Cree LED recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
MOISTURE SENSITIVITY
Cree LED recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MH Family LEDs may be stored as MSL 1 per JEDEC J‑STD‑033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree LED recommends sealing any unsoldered
LEDs in the original MBP.
LOW TEMPERATURE OPERATION
The minimum operating temperature of these XLamp LED components is ‑40 °C. To maximize lifetime, Cree LED recommends avoiding
applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.
NOTES ON SOLDERING XLAMP
®
MH FAMILY LEDS - CONTINUED
