XLAMP
®
MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree
®
and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp
®
is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4
11
ASSEMBLY STORAGE & HANDLING
Do not stack PCBs or assemblies containing XLamp MH Family LEDs so that anything rests on the LED optical surface. PCBs or assemblies
containing XLamp MH Family LEDs should be stacked in a way to allow at least 1-cm clearance above the LED optical surface.
Do not use bubble wrap directly on top of XLamp MH Family LEDs. Force from the bubble wrap can potentially damage the LED.
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CORRECT
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WRONG
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CORRECT
